Tantalum capacitor

About: Tantalum capacitor is a research topic. Over the lifetime, 2432 publications have been published within this topic receiving 26709 citations.

Fabrication method for thin film capacitors

Abstract: A capacitor is fabricated on a base surface by applying a first pattern of electrical conductors (a first capacitor plate) over the base surface with an outer surface of the first pattern of electrical conductors including molybdenum. A first hard portion of a capacitor dielectric layer including amorphous hydrogenated carbon is deposited over the first capacitor plate and the base surface, a soft portion of the capacitor dielectric layer is deposited over the first hard portion, and a second hard portion of the capacitor dielectric layer is deposited over the soft portion. The deposition of the soft portion occurs at a lower bias voltage than the deposition of the first and second hard portions. A second pattern of electrical conductors (a second capacitor plate) is applied over the capacitor dielectric layer which is then patterned. A polymer layer is applied over the first and second capacitor plates, and two vias are formed, a first via extending to the first capacitor plate and a second via extending to the second capacitor plate. An electrode-coupling pattern of electrical conductors is applied over the polymer layer, a first portion extending into the first via and a second portion extending into the second via. Deposition of the capacitor dielectric layer can include using a methylethylketone precursor. Additional capacitor dielectric layers and plates having staggered via landing pads can be layered to increase the capacitance.

Solid electrolytic capacitor and its manufacturing method

Abstract: A solid electrolytic capacitor of the present invention has a structure where respective anode sections of capacitor elements are joined to an anode lead frame by resistance welding via a through hole formed in the anode lead frame Current thus collects to the through hole during the welding to break a dielectric oxide film layer to expose aluminum foil, and the molten aluminum collects into the through hole Stable welding work is therefore allowed without splashing the aluminum, and a solid electrolytic capacitor having high welding strength, high reliability, and reduced ESR can be obtained

Methods of forming capacitors and integrated circuit devices including tantalum nitride

Abstract: Methods of forming a capacitor can include forming a capacitor electrode including tantalum nitride. The capacitor electrode can be formed using a tantalum precursor including tantalum elements and bonding elements that are chemically bonded to the tantalum elements. Moreover, the tantalum precursor can include at least one of a tantalum amine derivative and/or a tantalum halide derivative. Related methods of forming integrated circuit devices are also discussed.

High dielectric constant capacitor and method for manufacturing the same

Abstract: A high dielectric constant film comprised of at least a first dual-film layer, which includes a first tantalum oxide film, and a first metal oxide film which is made of a metal oxide whose valence is smaller than that of tantalum, and whose dielectric constant is equal to or greater than that of tantalum oxide. The first metal oxide film preferably has a thickness of less than approximately 50 angstroms, in order to thereby avoid the formation of a columnar structure, which has been identified as a principal cause of the high leakage current problem which has plagued presently available high dielectric constant capacitors. The first tantalum oxide film preferably has a thickness in the range of between approximately 5 angstroms to approximately 200 angstroms, with the ratio of the thickness of the first tantalum oxide film to the thickness of the first metal oxide film being in the range of 1:10 to 100:1. The high dielectric constant film preferably further includes a plurality of additional dual-film layers formed on the first dual-film layer, to thereby provide a multilayer high dielectric constant film. Each of the additional dual-film layers is preferably of the same construction as that of the first dual-film layer. The present invention also encompasses a high dielectric constant capacitor which incorporates the above-described high dielectric constant film, and a method for manufacturing the same.

Capacitor and method for fabricating the same

Abstract: A capacitor which includes a lower electrode 12 formed on a substrate 10 ; an insulation film 16 having an opening 24 on the lower electrode 12 ; a capacitor dielectric film 30 formed on the lower electrode 12 in the opening 24 and having a larger thickness at a peripheral part of the opening 24 than at a central part of the opening; and an upper electrode 32 formed on the capacitor dielectric film 30 . Thus, degradation of the breakdown voltage and stress resistance of the peripheral part of the opening 24 , which is due to the coverage of the capacitor dielectric film, can be suppressed.