Topic
Tantalum capacitor
About: Tantalum capacitor is a research topic. Over the lifetime, 2432 publications have been published within this topic receiving 26709 citations.
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10 Aug 1998
TL;DR: In this paper, a multilayered interconnection and a capacitor dielectric element is provided, in which the transistor in the device has a non-degraded characteristics and the degradation of the capacitance is suppressed.
Abstract: A semiconductor device is provided with a multilayered interconnection and a capacitor dielectric element, in which the transistor in the device has a non-degraded characteristics and the degradation of the capacitor dielectric element is suppressed. The semiconductor device has wiring layers connecting to one another through contact holes in insulating layers. One of the insulating layers is formed so as to cover at least a part of the area above the transistor and so as not to cover the area above the capacitor dielectric element. Hydrogen generated by heat-treating the insulating layer is supplied to the transistor to recover the damage in it, while hydrogen is suppressed from arriving at the capacitor element so that the capacitor dielectric element does not degrade.
8 citations
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08 Jul 1996TL;DR: In this article, a dielectric is formed from the first conductive plate of a capacitor by oxidizing a metal layer in an electrolytic solution, which is then replaced by the second and third conductive plates.
Abstract: A capacitor formed by a process using only two deposition steps and a dielectric formed by oxidizing a metal layer in an electrolytic solution. The capacitor has first and second conductive plates and a dielectric is formed from the first conductive plate.
8 citations
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16 Jan 1990TL;DR: In this paper, a service mountable non-polar capacitor assembly is described, which includes a pair of polar tantalum capacitors disposed in axial alignment the anode rods of the capacitors being mechanically and electrically connected as by welding.
Abstract: A service mountable non-polar capacitor assembly is disclosed. The assembly includes a pair of polar tantalum capacitors disposed in axial alignment the anode rods of the capacitors being mechanically and electrically connected as by welding. An insulating sleeve encompasses the body portions of the capacitors leaving projecting portions extending beyond the ends of the sleeve. The void space within the sleeve between the opposed ends of the capacitors may be filled by a polymeric insulating and rigidifying material.
8 citations
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02 Dec 1994
TL;DR: In this paper, a multilayer capacitor which is low in impedance to a wide range of frequency through it is a single part and the inner electrodes overlap with each other through the intermediary of a ceramic layer to form a second capacitor element.
Abstract: PURPOSE: To obtain a multilayer capacitor which is low in impedance to a wide range of frequency through it is a single part. CONSTITUTION: Inner electrodes 15a and 15b are made to overlap with each other through the intermediary of a ceramic layer to form a first capacitor element 15, and inner electrodes 16a and 16b are made to overlap with each other through the intermediary of a ceramic layer to form a second capacitor element 16 relatively small in capacitance inside a sintered body 12 formed of dielectric ceramic, the capacitor elements 15 and 16 are connected in parallel between a first outer electrode 13 and a second outer electrode 14 formed on the outer surface of the sintered body 12 to form a composite-type multilayer capacitor 11. COPYRIGHT: (C)1996,JPO
8 citations
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Rohm1
TL;DR: In this paper, a process for making a tantalum capacitor chip is described, which includes an anode wire partially inserted into and partially projecting from the chip body, and the process comprises the steps of compacting an initial divided amount of tantalum powder into an initial mass portion which is dimensionally smaller than the chip, and compacting at least one additional divided amount with the original mass portion into the Chip body.
Abstract: A process is provided for making a tantalum capacitor chip which includes a tantalum chip body as well as an anode wire partially inserted into and partially projecting from the chip body. The process comprises the steps of compacting an initial divided amount of tantalum powder into an initial mass portion which is dimensionally smaller than the chip body, and compacting at least one additional divided amount of tantalum powder with the initial mass portion into the chip body. The capacitor chip thus obtained may be enclosed in a resin package to provide a surface mounting type tantalum capacitor.
8 citations