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Tantalum capacitor

About: Tantalum capacitor is a research topic. Over the lifetime, 2432 publications have been published within this topic receiving 26709 citations.


Papers
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Patent
23 Jun 1993
TL;DR: In this article, a dielectric layer made of a silicon nitride-based ceramic containing silicon carbide in an amount of from 13 to 30% by weight is presented.
Abstract: In a substrate having built-in capacitor which is incorporated in and united with an insulator, the capacitor has a dielectric layer made of a silicon nitride-based ceramic containing silicon carbide in an amount of from 13 to 30% by weight.

21 citations

Patent
28 Apr 1995
TL;DR: In this article, a metal-oxide dielectric layer is formed with an upper electrode layer that is electrically connected to an underlying circuit element, which may be used in forming storage capacitors for DRAM and NVRAM cells.
Abstract: A capacitor with a metal-oxide dielectric layer is formed with an upper electrode layer that is electrically connected to an underlying circuit element. The capacitor may be used in forming storage capacitors for DRAM and NVRAM cells. After forming an underlying circuit element, such as a source/drain region of a transistor, a metal-oxide capacitor is formed over the circuit element. An opening is formed through the capacitor and extends to the circuit element. An insulating spacer is formed, and a conductive member is formed that electrically connects the circuit element to the upper electrode layer of the metal-oxide capacitor. Devices including DRAM and NVRAM cells and methods of forming them are disclosed.

21 citations

Journal ArticleDOI
TL;DR: In this paper, strong space charge response is observed in SiC ceramic capacitors at low frequencies up to 0.1MHz and the critical temperature is observed near 773K.
Abstract: Strong space charge response is observed in SiC ceramic capacitors at low frequencies up to 0.1MHz. It leads to a dielectric constant of 2 910 000 at 100Hz. The critical temperature is observed near 773K. The losses decrease with increasing temperature. Strong frequency dependence of the dielectric properties is also detected. The SiC ceramic capacitor might be suitable as high-temperature by-pass capacitor in low voltage circuits.

21 citations

Patent
16 Mar 2011
TL;DR: In this article, high electric energy density polymer film capacitors with high dielectric constant and low dissipation tangent, and low leakage current in a broad temperature range are presented.
Abstract: Examples of the present invention include high electric energy density polymer film capacitors with high dielectric constant, low dielectric dissipation tangent, and low leakage current in a broad temperature range. More particularly, examples include a polymer film capacitor in which the dielectric layer comprise a copolymer of a first monomer (such as tetrafluoroethylene) and a second polar monomer. The second monomer component may be selected from vinylidene fluoride, trifluoroethylene or their mixtures, and optionally other monomers may be included to adjust the mechanical performance. The capacitors can be made by winding metallized films, plain films with metal foils, or hybrid construction where the films comprise the new compositions. The capacitors can be used in DC bus capacitors and energy storage capacitors in pulsed power systems.

21 citations

Patent
08 May 1997
TL;DR: A multilayer capacitor capable of reducing electrical field intensity at external electrode edges while preventing occurrence of surface dielectric breakdown was proposed in this paper, where the external electrodes formed on respective opposite external side surfaces of the capacitor main body and each connected to certain ones of the internal electrodes.
Abstract: A multilayer capacitor capable of having reducing electrical field intensity at external electrode edges while preventing occurrence of surface dielectric breakdown. This multilayer capacitor has a capacitor main body which includes a capacitance formation section having alternately laminated pluralities of internal electrodes and dielectric layers, and outer dielectric layer sections laminated on the upper and lower surfaces of the capacitance formation section. The capacitor also has external electrodes formed on respective opposite external side surfaces of the capacitor main body and each connected to certain ones of the internal electrodes. The outer layer sections each have respective dielectric breakdown prevention layers therein, each of which exhibits a carefully designed relative dielectric constant e which is less than that of the dielectric layers in the capacitance formation section, and not more than 300, and has a thickness d μm! satisfying the relation: d>(0.2×e)+20.

21 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20238
20227
20219
202020
201924
201834