Texture (crystalline)

About: Texture (crystalline) is a research topic. Over the lifetime, 22138 publications have been published within this topic receiving 351826 citations.

Electroceramics: Characterization by Impedance Spectroscopy

Abstract: Electroceramics are advanced materials whose properties and applications depend on the close control of structure, composition, ceramic texture, dopants and dopant (or defect) distribution. Impedance spectroscopy is a powerful technique for unravelling the complexities of such materials, which functions by utilizing the different frequency dependences of the constituent components for their separation. Thus, electrical inhomogeneities in ceramic electrolytes, electrode/electrolyte interfaces, surface layers on glasses, ferroelectricity, positive temperature coefficient of resistance behavior and even ferrimagnetism can all be probed, successfully, using this technique.

Fine-structured aluminium products with controllable texture by selective laser melting of pre-alloyed AlSi10Mg powder

Abstract: This study shows that AlSi10Mg parts with an extremely fine microstructure and a controllable texture can be obtained through selective laser melting (SLM). Selective laser melting creates complex functional products by selectively melting powder particles of a powder bed layer after layer using a high-energy laser beam. The high-energy density applied to the material and the additive character of the process result in a unique material structure. To investigate this material structure, cube-shaped SLM parts were made using different scanning strategies and investigated by microscopy, X-ray diffraction and electron backscattered diffraction. The experimental results show that the high thermal gradients occurring during SLM lead to a very fine microstructure with submicron-sized cells. Consequently, the AlSi10Mg SLM products have a high hardness of 127 ± 3 Hv0.5 even without the application of a precipitation hardening treatment. Furthermore, due to the unique solidification conditions and the additive character of the process, a morphological and crystallographic texture is present in the SLM parts. Thanks to the knowledge gathered in this paper on how this texture is formed and how it depends on the process parameters, this texture can be controlled. A strong fibrous 〈1 0 0〉 texture can be altered into a weak cube texture along the building and scanning directions when a rotation of 90° of the scanning vectors within or between the layers is applied.

Introduction to texture analysis : macrotexture, microtexture and orientation mapping

Abstract: Part I: Fundamental Issues Introduction The Classical Approach to Texture The Modern Approach to Texture: Microtexture A Guide to the Book Descriptors of Orientation Crystal Structures and Crystal Symmetries Transformation between Coordinate Systems: The Rotation Matrix The "Ideal Orientation" (Miller or Miller-Bravais Indices) Notation The Reference Sphere, Pole Figure, and Inverse Pole Figure The Euler Angles and Euler Space The Angle/Axis of Rotation and Cylindrical Angle/Axis Space The Rodrigues Vector and Rodrigues Space Application of Diffraction to Texture Analysis Diffraction of Radiation and Bragg's Law Structure Factor Laue and Debye-Scherrer Methods Absorption and Depth of Penetration Characteristics of Radiations Used for Texture Analysis Part II: Macrotexture Analysis Macrotexture Measurements Principle of Pole Figure Measurement X-Ray Diffraction Methods Neutron Diffraction Methods Texture Measurements in Low-Symmetry and Multiphase Materials Sample Preparation Evaluation and Representation of Macrotexture Data Pole Figure and Inverse Pole Figure Determination of the Orientation Distribution Function from Pole Figure Data Representation and Display of Texture in Euler Space Examples of Typical Textures in Metals Part III: Microtexture Analysis The Kikuchi Diffraction Pattern The Kikuchi Diffraction Pattern Quantitative Evaluation of the Kikuchi Pattern Pattern Quality Scanning Electron Microscopy-Based Techniques Micro-Kossel Technique Electron Channeling Diffraction and Selected-Area Channeling Evolution of Electron Backscatter Diffraction EBSD Specimen Preparation Experimental Considerations for EBSD Calibration of an EBSD System Operation of an EBSD System and Primary Data Output Transmission Electron Microscopy-Based Techniques High-Resolution Electron Microscopy Selected Area Diffraction Kikuchi Patterns, Microdiffraction, and Convergent Beam Electron Diffraction Evaluation and Representation of Microtexture Data Representation of Orientations in a Pole Figure or Inverse Pole Figure Representation of Orientations in Euler Space Representation of Orientations in Rodrigues Space General Representation of Misorientation Data Representation of Misorientations in Three-Dimensional Spaces Normalization and Evaluation of the Misorientation Distribution Function Extraction of Quantified Data Orientation Microscopy and Orientation Mapping Historical Evolution Orientation Microscopy Orientation Mapping and Its Applications Orientation Microscopy in the TEM Crystallographic Analysis of Interfaces, Surfaces, and Connectivity Crystallographic Analysis of Grain Boundaries Crystallographic Analysis of Surfaces Orientation Connectivity and Spatial Distribution Orientation Relationships between Phases Synchrotron Radiation, Nondiffraction Techniques, and Comparisons between Methods Texture Analysis by Synchrotron Radiation Texture Analysis by Nondiffraction Techniques Appendices Glossary References General Bibliography Index

Crystallographic texture evolution in bulk deformation processing of FCC metals

Abstract: A Taylor-type polycrystalline model, together with a new fully-implicit time-integration scheme has been developed and implemented in a finite element program to simulate the evolution of crystallographic texture during bulk deformation processing of face centered cubic metals deforming by crystallographic slip. The constitutive equations include a new equation for the evolution of slip system deformation resistance which leads to macroscopic strain hardening behavior that is in good accord with experiments performed on OFHC copper. The good predictive capabilities of the constitutive equations and the time-integration procedure for simulating the stress-strain behavior and the evolution of texture under both homogeneous and non-homogeneous deformation conditions are demonstrated by comparing numerical simulations against experimental measurements in simple shear and a simple plane-strain forging experiment on copper.

High critical current density superconducting tapes by epitaxial deposition of YBa2Cu3Ox thick films on biaxially textured metals

Abstract: A method to obtain long lengths of flexible, biaxially oriented substrates with smooth, chemically compatible surfaces for epitaxial growth of high‐temperature superconductors is reported. The technique uses well established, industrially scalable, thermomechanical processes to impart a strong biaxial texture to a base metal. This is followed by vapor deposition of epitaxial buffer layers (metal and/or ceramic) to yield chemically compatible surfaces. Epitaxial YBa2Cu3Ox films grown on such substrates have critical current densities exceeding 105 A/cm2 at 77 K in zero field and have field dependencies similar to epitaxial films on single crystal ceramic substrates. Deposited conductors made using this technique offer a potential route for the fabrication of long lengths of high‐Jc wire capable of carrying high currents in high magnetic fields and at elevated temperatures.