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Thermal expansion

About: Thermal expansion is a research topic. Over the lifetime, 21040 publications have been published within this topic receiving 349407 citations. The topic is also known as: heat expansion.


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Patent
11 Dec 1990
TL;DR: In this article, a method of controlling deposition quality of line-of-sight and specimen surrounding surfaces in a plasma-enhanced chemical vapor deposition apparatus is presented, which is improved by avoiding differential thermal expansion of the film and the underlying surfaces, controlling geometry of the surfaces to eliminate edges which generate stress in the deposited film, and using material for the surface which provides strong adhesion.
Abstract: A method of controlling deposition quality of line-of-sight and specimen surrounding surfaces in a plasma-enhanced chemical vapor deposition apparatus. Adhesion and integrity of deposited film on the surfaces is improved by one or more of (1) avoiding differential thermal expansion of the film and the underlying surfaces, (2) controlling geometry of the surfaces to eliminate edges which generate stress in the deposited film, and (3) using material for the surface which provides strong adhesion of the deposited film. For instance, differential thermal expansion can be avoided by maintaining the surfaces at a substantially constant temperature such as ambient temperature.

79 citations

Journal ArticleDOI
TL;DR: In this article, the density and thermal expansion coefficient of molten silicon with various dopants (Sb, B and Ga) were measured in the wide temperature range from 1100 to 1730°C including undercooled region of 300 K using an electromagnetic levitation.

79 citations

Journal ArticleDOI
TL;DR: In this paper, the effect of temperature on the physical and mechanical properties of typical steels and concretes which are used in PCRV design are presented, and special consideration has been given to the properties and phenomena concerning thermal behaviour, e.g. thermal diffusivity and conductivity, specific heat, density, thermal expansion and decomposition effects.

79 citations

Journal ArticleDOI
TL;DR: The results provide the first concrete link between mechanical strain and WF of an organic semiconductor and have important implications for understanding the connection between structural and electronic disorder in soft organic electronic materials.
Abstract: Establishing fundamental relationships between strain and work function (WF) in organic semiconductors is important not only for understanding electrical properties of organic thin films, which are subject to both intrinsic and extrinsic strains, but also for developing flexible electronic devices. Here we investigate tensile and compressive strain effects on the WF of rubrene single crystals. Mechanical strain induced by thermal expansion mismatch between the substrate and rubrene is quantified by X-ray diffraction. The corresponding WF change is measured by scanning Kelvin probe microscopy. The WF of rubrene increases (decreases) significantly with in-plane tensile (compressive) strain, which agrees qualitatively with density functional theory calculations. An elastic-to-plastic transition, characterized by a steep rise of the WF, occurs at ∼0.05% tensile strain along the rubrene π-stacking direction. The results provide the first concrete link between mechanical strain and WF of an organic semiconductor and have important implications for understanding the connection between structural and electronic disorder in soft organic electronic materials.

79 citations

Journal ArticleDOI
TL;DR: In this paper, the effect of water on the thermal expansion behavior of a negative thermal expansion system is discussed. But the authors focus on the non-negative thermal expansion of a trihydrate composition whose X-ray diffraction pattern can be indexed to an orthorhombic unit cell.

79 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023603
20221,249
2021683
2020742
2019759
2018767