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Thermal expansion

About: Thermal expansion is a research topic. Over the lifetime, 21040 publications have been published within this topic receiving 349407 citations. The topic is also known as: heat expansion.


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Journal ArticleDOI
TL;DR: A general nano-mechanical test platform capable of performing variable temperature and variable strain rate testing in situ in the scanning electron microscope is described, and the effects of indenter geometry and of radiation on imaging conditions are discussed.
Abstract: A general nano-mechanical test platform capable of performing variable temperature and variable strain rate testing in situ in the scanning electron microscope is described. A variety of test geometries are possible in combination with focused ion beam machining or other fabrication techniques: indentation, micro-compression, cantilever bending, and scratch testing. The system is intrinsically displacement-controlled, which allows it to function directly as a micro-scale thermomechanical test frame. Stable, elevated temperature indentation/micro-compression requires the indenter tip and the sample to be in thermal equilibrium to prevent thermal displacement drift due to thermal expansion. This is achieved through independent heating and temperature monitoring of both the indenter tip and sample. Furthermore, the apex temperature of the indenter tip is calibrated, which allows it to act as a referenced surface temperature probe during contact. A full description of the system is provided, and the effects of indenter geometry and of radiation on imaging conditions are discussed. The stabilization time and temperature distribution throughout the system as a function of temperature is characterized. The advantages of temperature monitoring and thermal calibration of the indenter tip are illustrated, which include the possibility of local thermal conductivity measurement. Finally, validation results using nanoindentation on fused silica and micro-compression of ⟨100⟩ silicon micro-pillars as a function of temperature up to 500 °C are presented, and procedures and considerations taken for these measurements are discussed. A brittle to ductile transition from fracture to splitting then plastic deformation is directly observed in the SEM for silicon as a function of temperature.

141 citations

Journal ArticleDOI
TL;DR: The thermal expansion coefficient of forsterite increases smoothly from 2.8 to 4.5 K−1 from 400 K to 2160 K as discussed by the authors, indicating that defects do not make a large contribution to thermal expansion near the melting point.
Abstract: As determined from powder X-ray diffraction experiments with synchrotron radiation, the thermal expansion coefficient of forsterite increases smoothly from 2.8 to 4.5 K−1 from 400 K to 2160 K. No anomalous increases of the cell parameters are observed near the melting point. The consistency between the observed and calculated value of the initial slope of the melting curve of forsterite suggests that defects do not make a large contribution to thermal expansion near the melting point. Along with previous results, the new data confirm the influence of anharmonicity on the high-temperature heat capacity of forsterite and indicate that both the Gruneisen parameter and αKT (α = thermal expansion coefficient, KT = bulk modulus) have nearly constant values at high temperatures.

141 citations

Journal ArticleDOI
TL;DR: In this paper, a new nanofabrication procedure has been developed for making thermocouple probes for high-resolution scanning thermal microscopy, which can achieve a spatial resolution of 24 nm.
Abstract: A new nanofabrication procedure has been developed for making thermocouple probes for high-resolution scanning thermal microscopy. Thermocouple junctions were placed at the end of SiNx cantilever probe tips and were typically 100–500 nm in diameter. Cantilever bending due to thermal expansion mismatch was minimized for Au–Ni, Au–Pt, and Au–Pd thermocouples, by carefully choosing thermal probe materials, film thicknesses, and deposition conditions. A spatial resolution of 24 nm was demonstrated for thermal microscopy although the noise-equivalent limit of 10 nm was estimated from experimental data. Using thermo-power measurements, a simple model was developed to calculate the tip-sample thermal resistance. Model-based calculations, correlations between topographical and thermal features, as well as experiments in different gaseous and humidity environments indicate that the dominant tip-surface heat conduction is most likely through a liquid film bridging the tip and the sample surface, and not through the surrounding gas, solid-solid point contact, or near-field radiation. Dynamic measurements within a 100 kHz bandwidth showed a time constant of about 0.15±0.02 ms which was attributed to the thermal time constant of the whole cantilever. Calculations suggested the RC electrical time constant and the thermal time constant of the thermocouple junction to be on the order of 10 ns which, however, could not be experimentally probed.

140 citations

Journal ArticleDOI
TL;DR: In this paper, the authors measured the thermal capacities, thermalexpansion coefficients, thermal and electrical conductivities of Nb2AlC (actual Nb:Al:C mole fractions: 0.525±0.005, 0.240±
Abstract: The heat capacities, thermal-expansion coefficients, thermal and electrical conductivities of Nb2AlC (actual Nb:Al:C mole fractions: 0.525±0.005, 0.240±0.002, and 0.235±0.005, respectively), Ti2AlC and (Ti, Nb)2AlC (actual Ti:Nb:Al:C mole fractions: 0.244±0.005, 0.273±0.005, 0.240±0.003, and 0.244±0.005, respectively) were measured as a function of temperature. These ternaries are good electrical conductors, with a resistivity that increases linearly with increasing temperatures. The resistivity of (Ti, Nb)2AlC is higher than the other members, indicating a solid-solution scattering effect. The thermal-expansion coefficients, in the 25 °C to 1000 °C temperature range, are comparable and fall in the narrow range of 8.7 to 8.9 × 10−6 K−1, with that of the solid solution being the highest. They are all good conductors of heat, with thermal conductivities in the range between 15 to 45 W/m K at room temperature. The electronic component of the thermal conductivity is the dominant mechanism at all temperatures for Nb2AlC and (Ti, Nb)2AlC. The conductivity of Ti2AlC, on the other hand, is high because the phonon contribution to the conductivity is nonnegligible.

140 citations

Journal ArticleDOI
John A. Nairn1
TL;DR: In this paper, the authors present a thermoelastic analysis of the composite cylinder model for a undirectional composite including anisotropic fibers and an interphase region, and find the magnitude of residual thermal stresses on the micromechanics level induced by differential shrinkage between the fiber and the matrix.
Abstract: We present a thermoelastic analysis of the composite cylinder model for a undirectional composite including anisotropic fibers and an interphase region. We have found the magnitude of the residual thermal stresses on the micromechanics level induced by differential shrinkage between the anisotropic fibers and the matrix. For typical composites the largest residual stress is tension along the fiber direction, and a simple lower bound expression for this stress is given. Prediction of the magnitude of the thermal stresses requires knowledge of the thermal and physical properties of the matrix. The relevant properties for epoxy and thermoplastic matrices are discussed. The magnitude of the residual stresses can be reduced by tailoring the interphase region, but only if the interphase region serves to reduce the temperature for the onset of stress buildup. The volume fraction dependence of the longitudinal and transverse thermal expansion coefficients of the composite is compared to analogous expressions in the literature which do not include anisotropy of the fibers.

140 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023603
20221,249
2021683
2020742
2019759
2018767