Thin-film transistor

About: Thin-film transistor is a research topic. Over the lifetime, 48425 publications have been published within this topic receiving 680879 citations. The topic is also known as: TFT.

Water-induced scandium oxide dielectric for low-operating voltage n- and p-type metal-oxide thin-film transistors

Abstract: Solution-processed metal-oxide thin films based on high dielectric constant (k) materials have been extensively studied for use in low-cost and high-performance thin-film transistors (TFTs). Here, scandium oxide (ScOx) is fabricated as a TFT dielectric with excellent electrical properties using a novel water-inducement method. The thin films are annealed at various temperatures and characterized by using X-ray diffraction, atomic-force microscopy, X-ray photoelectron spectroscopy, optical spectroscopy, and a series of electrical measurements. The optimized ScOx thin film exhibits a low-leakage current density of 0.2 nA cm−2 at 2 MV cm−1, a large areal capacitance of 460 nF cm−2 at 20 Hz and a permittivity of 12.1. To verify the possible applications of ScOx thin films as the gate dielectric in complementary metal oxide semiconductor (CMOS) electronics, they were integrated in both n-type InZnO (IZO) and p-type CuO TFTs for testing. The water-induced full oxide IZO/ScOx TFTs exhibit an excellent performance, including a high electron mobility of 27.7 cm2 V−1 s−1, a large current ratio (Ion/Ioff) of 2.7 × 107 and high stability. Moreover, as far as we know it is the first time that solution-processed p-type oxide TFTs based on a high-k dielectric are achieved. The as-fabricated p-type CuO/ScOx TFTs exhibit a large Ion/Ioff of around 105 and a hole mobility of 0.8 cm2 V−1 at an operating voltage of 3 V. To the best of our knowledge, these electrical parameters are among the highest performances for solution-processed p-type TFTs, which represents a great step towards the achievement of low-cost, all-oxide, and low-power consumption CMOS logics.

Liquid crystal display device having LDD structure type thin film transistors connected in series

Abstract: A thin film transistor structure for a liquid crystal display device of the active matrix type, wherein leak current is suppressed to stabilize the threshold voltage and the dispersion in the gate capacitance coupling and the channel length are minimized, is disclosed. The liquid crystal display device comprises a substrate having picture element electrodes arranged in a matrix and switching elements for driving the picture element electrodes, another substrate having opposing electrodes thereon and opposed to the former substrate, and a liquid crystal layer held between the substrates. Each switching element has a multi-gate structure wherein two thin film transistors are connected in series and gate electrodes are electrically connected to each other. Each thin film transistor has a lightly doped drain structure wherein a low density impurity region of the same conductivity type as that of a source region or a drain region is provided at least between the source or drain region and a channel region. At least one of a plurality of such low density impurity regions may have a length or a density different from that of the other low density impurity regions so as to assure sufficient on-current while suppressing the leak current.

Thin film semiconductor and process for producing the same

Abstract: A thin film semiconductor which comprises a substrate, a single crystalline silicone thin film layer and an intermediate layer disposed between the substrate and the single-crystalline silicon thin film layer. Coefficient of the thermal expansion of the intermediate layer is between those of the substrate and the single-crystalline silicon. The intermediate layer absorbs thermal stress and relaxes strain remaining in the silicon layer, which strain is generated due to difference of thermal expansion coefficient between the substrate and the silicon layer. Due to the arrangement of the intermediate layer, it becomes possible to use various material as the substrate without generating micro-cracks and produce a semiconductor device using a large sized substrate.

Organic electroluminescent device and method of fabricating the same

Abstract: An organic electroluminescent device includes: first and second substrates facing each other and spaced apart from each other, the first and second substrates having a central portion and a peripheral portion; an array layer on the first substrate, the array layer including a thin film transistor; an organic electroluminescent diode on the second substrate; a connection pattern between the first and second substrates, the connection pattern electrically connecting the thin film transistor and the organic electroluminescent diode; and a seal pattern in the peripheral portion, the seal pattern including a metallic material for attaching the first and second substrates.

Organic electroluminescent display device

Abstract: An organic electroluminescent display device includes at least a driving TFT and pixels which are formed by organic electroluminescent elements and are provided on a substrate of the TFT. The driving TFT includes at least a substrate, a gate electrode, a gate insulating film, an active layer, a source electrode, and a drain electrode. The driving TFT further includes a resistive layer between the active layer and at least one of the source electrode and the drain electrode. The pixels include at least one color-modified pixel which has a color filter that modifies the emission color of the color-modified pixel, and which emits light of the modified color.