Thin-film transistor

About: Thin-film transistor is a research topic. Over the lifetime, 48425 publications have been published within this topic receiving 680879 citations. The topic is also known as: TFT.

Solvent-induced phase transition in thermally evaporated pentacene films

Abstract: We report a solvent-induced phase transition in pentacene thin films, from a “thin film” phase to a bulk-like phase. X-ray diffraction indicates that as-deposited thermally evaporated pentacene films consist mainly of (001)-oriented pentacene with an elongated (001) plane spacing of 15.5±0.1 A, and a minor amount with a (001) plane spacing of 14.5±0.1 A. When such films are exposed to solvents such as acetone, isopropanol, or ethanol, the plane spacing of the entire layer shifts abruptly from the elongated (001) plane spacing to the bulk value and this shift is accompanied by a macroscopic change in film morphology. While molecular ordering is maintained as indicated by x-ray diffraction, thin film transistor performance is severely degraded, most likely as a result of the morphological changes in the film.

Field effect transistor with amorphous oxide active layer containing microcrystals and gate electrode opposed to active layer through gate insulator

Abstract: A novel amorphous oxide applicable, for example, to an active layer of a TFT is provided. The amorphous oxide comprises microcrystals.

Ambipolar, high performance, acene-based organic thin film transistors.

Abstract: We present a high performance, ambipolar organic field-effect transistor composed of a single material. Ambipolar molecules are rare, and they can enable low-power complementary-like circuits. This low band gap, asymmetric linear acene contains electron-withdrawing fluorine atoms, which lower the molecular orbital energies, allowing the injection of electrons. While hole and electron mobilities of up to 0.071 and 0.37 cm2/V·s, respectively, are reported on devices measured in nitrogen, hole mobilities of up to 0.12 cm2/V·s were found in ambient, with electron transport quenched. These devices were fabricated on octadecyltrimethoxysilane-treated surfaces at a substrate temperature of 60 °C.

Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate

Abstract: A method of providing a first and a second Silicon-on-Insulator (SOI) wafer, wherein each SOI wafer includes a silicon layer separated from a bulk silicon substrate by a layer of dielectric material, typically SiO2. Next, at least one electrical feedthrough is formed in each of the silicon layers and active and passive devices are formed in each of the thin silicon layers. Next, interconnects are formed that overlie the silicon layer and are electrically coupled to the feedthrough. One of the wafers is then attached to a temporary substrate such that the interconnects are interposed between the thin silicon layer and the temporary substrate. The bulk silicon substrate of the wafer having the temporary substrate is then etched to expose the dielectric layer. Further interconnects are then formed through the exposed dielectric layer for electrically contacting the at least one feedthrough. This results in the formation of a first circuit assembly. A next step then couples the further interconnects of the circuit assembly to the interconnects of the second SOI wafer, the second SOI wafer having a bulk substrate, a dielectric layer overlying a surface of the substrate, and a layer of processed silicon overlying the dielectric layer. The temporary substrate is then removed. Additional circuit assemblies may then be stacked and interconnected to form a 3d integrated circuit.

Wafer-sized multifunctional polyimine-based two-dimensional conjugated polymers with high mechanical stiffness

Abstract: One of the key challenges in two-dimensional (2D) materials is to go beyond graphene, a prototype 2D polymer (2DP), and to synthesize its organic analogues with structural control at the atomic- or molecular-level. Here we show the successful preparation of porphyrin-containing monolayer and multilayer 2DPs through Schiff-base polycondensation reaction at an air-water and liquid-liquid interface, respectively. Both the monolayer and multilayer 2DPs have crystalline structures as indicated by selected area electron diffraction. The monolayer 2DP has a thickness of∼0.7 nm with a lateral size of 4-inch wafer, and it has a Young's modulus of 267±30 GPa. Notably, the monolayer 2DP functions as an active semiconducting layer in a thin film transistor, while the multilayer 2DP from cobalt-porphyrin monomer efficiently catalyses hydrogen generation from water. This work presents an advance in the synthesis of novel 2D materials for electronics and energy-related applications.