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Ultrasonic consolidation

About: Ultrasonic consolidation is a research topic. Over the lifetime, 183 publications have been published within this topic receiving 3899 citations. The topic is also known as: UC & UAM.


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Journal ArticleDOI
TL;DR: In this article, the composites formed using main rapid prototyping processes such as Selective Laser Sintering/Melting, Laser Engineered Net Shaping, Laminated Object Manufacturing, Stereolithography, Fused Deposition Modeling, Three Dimensional Printing and Ultrasonic Consolidation are discussed.

436 citations

Journal ArticleDOI
TL;DR: In this paper, the ultrasonic consolidation (UC) process is presented for the direct fabrication of monolithic aluminium tooling and components, which involves the use of high frequency, low amplitude, mechanical vibrations to bond metal foils in a layer-by-layer method.

168 citations

Journal ArticleDOI
TL;DR: In this paper, the authors considered control parameter optimisation and surface preparation issues for the production of aluminium alloy 6061 specimens, and showed that the dynamic interfacial stresses, generated under UC conditions, compacted the oxide layer to form brittle, ceramic bonds at the weld interface.
Abstract: Ultrasonic consolidation (UC) is a freeform fabrication technique developed for the layered fabrication of metal parts. The process uses a high intensity ultrasonic energy source to induce combined static and oscillating shear forces within layers of metal foil to produce solid-state bonds. This paper will consider control parameter optimisation and surface preparation issues, for the production of aluminium alloy 6061 specimens. It will assess weld quality through both mechanical testing and optical observation. Aluminium 6061 specimens were successfully welded by the UC machine using both unprepared and surface prepared foils. In the unprepared specimens, thick oxide films exist along the whole specimen length of the weld interface. Results showed that the dynamic interfacial stresses, generated under UC conditions, compact the oxide layer to form brittle, ceramic bonds at the weld interface. A simple cleaning procedure increased metallurgical bonds, within the weld interface, by up to 45%. A general process window was produced for 6061 alloy based on a combination of the peel test data and microstructural analysis.

163 citations

Journal ArticleDOI
TL;DR: In this paper, the authors examined the suitability of the Ultrasonic Consolidation (UC) process for fabrication of parts in multi-materials and found that most of the materials investigated can be successfully bonded to alloy Al 3003 and vice versa.
Abstract: Purpose – Ultrasonic consolidation (UC) is a novel additive manufacturing process developed for fabrication of metallic parts from foils. While the process has been well demonstrated for part fabrication in Al alloy 3003, some of the potential strengths of the process have not been fully explored. One of them is its suitability for fabrication of parts in multi‐materials. This work aims to examine this aspect.Design/methodology/approach – Multi‐material UC experiments were conducted using Al alloy 3003 foils as the bulk part material together with a number of engineering materials (foils of Al‐Cu alloy 2024, Ni‐base alloy Inconel 600® AISI 347 stainless steel, and others). Deposit microstructures were studied to evaluate bonding between various materials.Findings – It was found that most of the materials investigated can be successfully bonded to alloy Al 3003 and vice versa. SiC fibers and stainless wire meshes were successfully embedded in an Al 3003 matrix. The results suggest that the UC process is qu...

158 citations

Journal ArticleDOI
TL;DR: In this paper, the effect of process parameters on linear weld density (LWD) in AI alloy 3003 UC parts was investigated and a set of optimum parameters for AI 3003 part fabrication using UC was obtained, which may vary for different foil materials and sonotrode/foil fric-tional conditions.

151 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20217
20207
20199
20189
20175
20169