Topic
X-ray lithography
About: X-ray lithography is a research topic. Over the lifetime, 5302 publications have been published within this topic receiving 70850 citations.
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TL;DR: A novel ordered silicon nano-conical-frustum array structure, exhibiting an impressive absorbance of 99% (upper bound) over wavelengths 400-1100 nm by a thickness of only 5 μm, is realized by the recently reported technique self-powered parallel electron lithography that has high-throughput and sub-35-nm high resolution.
Abstract: Nanostructured silicon thin film solar cells are promising, due to the strongly enhanced light trapping, high carrier collection efficiency, and potential low cost. Ordered nanostructure arrays, with large-area controllable spacing, orientation, and size, are critical for reliable light-trapping and high-efficiency solar cells. Available top-down lithography approaches to fabricate large-area ordered nanostructure arrays are challenging due to the requirement of both high lithography resolution and high throughput. Here, a novel ordered silicon nano-conical-frustum array structure, exhibiting an impressive absorbance of ∼99% (upper bound) over wavelengths 400−1100 nm by a thickness of only 5 μm, is realized by our recently reported technique self-powered parallel electron lithography that has high-throughput and sub-35-nm high resolution. Moreover, high-efficiency (up to 10.8%) solar cells are demonstrated, using these ordered ultrathin silicon nano-conical-frustum arrays. These related fabrication techni...
216 citations
Patent•
14 Mar 1991TL;DR: In this paper, a solid immersion lens having a spherical surface was used to enhance the resolution of a single-image lithography system employing a spherical lens for improving its resolution, and the system was shown to work well with a solid-immersion lens.
Abstract: A lithography system employing a solid immersion lens having a spherical surface to enhance its resolution is disclosed
214 citations
Patent•
11 Nov 2003
TL;DR: In this paper, a gas seal is formed between the sealing member and the plane of the substrate and the liquid is confined in that space, and the space between the final element of the projection system and the substrate table of the lithography projector is surrounded by a sealing member.
Abstract: PROBLEM TO BE SOLVED: To provide a lithography projector in which a space between a substrate and a projection system is filled with liquid while minimizing the quantity of the liquid required to be accelerated during a stage operation. SOLUTION: In the lithography projector, the space between the final element of the projection system and the substrate table of the lithography projector is surrounded by a sealing member. A gas seal is formed between the sealing member and the plane of the substrate and the liquid is confined in that space. COPYRIGHT: (C)2005,JPO&NCIPI
213 citations
TL;DR: In this paper, X-ray lithography using synchrotron radiation has been applied in a multi-step process for the production of plastic moulds to be used in the fabrication of separation nozzles by electrodeposition.
Abstract: X-ray lithography using synchrotron radiation has been applied in a multi-step process for the production of plastic moulds to be used in the fabrication of separation nozzles by electrodeposition. For characteristic dimensions of a few microns a total height of the nozzle structure of about 400 μm has been achieved. Structural details of about 0.1 μm are being reproduced across the total thickness of the polymer layer. The surface finish of metallic separation nozzles produced by electrodeposition was equivalent to the high quality of the polymer surface. The separation-nozzle systems fabricated by the described method allow an increase by a factor three of the gas pressure in separationnozzle plants as compared to the present standard. This results in considerable savings in the enrichment of 235U for nuclear power production.
211 citations
TL;DR: In this paper, the nano-print process is done in a single layer as well as in a multilayer resist scheme with subsequent O2-plasma etching and metal lift-off.
Abstract: We demonstrate the nanoimprint lithography (NIL) technique with sub 100 nm resolution, on 6 in. Si substrates. The pattern transfer is performed using a specially designed NIL machine optimized to achieve a very high degree of parallelism between stamp and substrate. The stamp is made with the help of electron beam lithography and Ni electroplating achieving features below 100 nm in size. The nanoimprint process is done in a single layer as well as in a multilayer resist scheme with subsequent O2-plasma etching and metal lift-off.
207 citations