Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

https://seniordesign.engr.uidaho.edu/2006_2007/am2/experimental%20_and_numerical_study_of_pressure_drop_and_heat_transfer_in_a_single-phase_micro-channel_heat_sink.pdf

Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink

Laser-based additive manufacturing (LBAM) processes can be utilized to generate functional parts (or prototypes) from the ground-up via layer-wise cladding – providing an opportunity to generate complex-shaped, functionally graded or custom-tailored parts that can be utilized for a variety of engineering applications. Directed Energy Deposition (DED), utilizes a concentrated heat source, which may be a laser or electron beam, with in situ delivery of powder- or wire-shaped material for subsequent melting to accomplish layer-by-layer part fabrication or single-to-multi layer cladding/repair. Direct Laser Deposition (DLD), a form of DED, has been investigated heavily in the last several years as it provides the potential to (i) rapidly prototype metallic parts, (ii) produce complex and customized parts, (iii) clad/repair precious metallic components and (iv) manufacture/repair in remote or logistically weak locations. DLD and Powder Bed Fusion-Laser (PBF-L) are two common LBAM processes for additive metal part fabrication and are currently demonstrating their ability to revolutionize the manufacturing industry; breaking barriers imposed via traditional, ‘subtractive’ metalworking processes. This article provides an overview of the major advancements, challenges and physical attributes related to DLD, and is one of two Parts focused specifically on DLD. Part I (this article) focuses on describing the thermal/fluidic phenomena during the powder-fed DLD process, while Part II focuses on the mechanical properties and microstructure of parts manufactured via DLD. In this current article, a selection of recent research efforts – including methodology, models and experimental results – will be provided in order to educate the reader of the thermal/fluidic processes that occur during DLD, as well as providing important background information relevant to DLD as a whole. The thermal/fluid phenomena inherent to DLD directly influence the solidification heat transfer which thus impacts the part's microstructure and associated thermo-mechanical properties. A thorough understanding of the thermal/fluid aspects inherent to DLD is vital for optimizing the DLD process and ensuring consistent, high-quality parts.

An overview of Direct Laser Deposition for additive manufacturing; Part I: Transport phenomena, modeling and diagnostics

PROTRACED COUNTERINSURGENCY: CHINESE COIN STRATEGY IN XINJIANG by MAJ J. Scott LaRonde, USA, 95 pages. In 1949, following the conclusion of its revolutionary war against the Chinese Nationalist forces, the People’s Liberation Army (PLA) peacefully occupied China’s western most province of Xinjiang. For nearly sixty years, the PLA has conducted a counterinsurgency against several, mostly Uyghur-led, separatist movements. Despite periods of significant violence, particularly in the early 1950s and again in the 1990s, the separatist forces have not gained momentum and remained at a level one insurgency. Mao ZeDeng is revered as a master insurgent and the father of Fourth Generation Warfare. Strategists in armies worldwide study his writings on revolutionary and guerilla warfare. This monograph concludes that Mao, as well as the communist leaders who followed him, was also successful at waging protracted counterinsurgency. For nearly sixty years, separatist movements in Xinjiang, Tibet, and Taiwan have all failed. This monograph analyzes the conflict in Xinjiang and concludes that the Chinese continue to defeat the separatist movement in Xinjiang through a strategy that counters Mao’s seven fundamentals of revolutionary warfare.

/pdf/approved-for-public-release-distribution-is-unlimited-2qs7y34q3g.pdf

Approved for Public Release; Distribution is Unlimited

https://docs.lib.purdue.edu/cgi/viewcontent.cgi?article=1010&context=coolingpubs

Investigation of heat transfer in rectangular microchannels

Developing convective heat transfer in deep rectangular microchannels

Preface Contributors Part I Fundamentals 1.Microscale Energy Transport in Solids 2.Heat Transport in Dielectric Thin Films and at Solid-Solid Interfaces 3.Microscale Radiation Phenomena 4.Melting and Freezing Phenomena 5.Molecular Clusters 6.Interfacial Forces and Phase Change in Thin Liquid Films Part II.Applications 7.Thermal Phenomena in Semiconductor Devices and Interconnects 8.Micro Heat Pipes 9.Microscale Heat Transfer in Biological Systems at Low Temperatures 10.Silicon Micromachined Thermal Sensors and Actuators Index

Microscale energy transport

A comprehensive film condensation heat transfer correlation, established on the basis of analytical and empirical results from the literature, is in excellent agreement with all existing data. It incorporates the effects of interfacial shear stress, interfacial waviness, and turbulent transport in the condensate film. The usefulness of this correlation is demonstrated for annular-film condensation inside tubes. This correlation can easily be incorporated into condensing models once the interfacial shear stress is known. Two cases, cocurrent annular-film condensation inside vertical and horizontal tubes and countercurrent annular-film reflux condensation such as occurs inside the two-phase closed thermosyphon, are used to demonstrate this procedure.

General film condensation correlations

In metal additive manufacturing (AM) processes, parts are manufactured in layers by sintering or melting metal or metal alloy powder under the effect of a powerful laser or an electron beam. As the laser/electron beam scans the powder bed, it melts the powder in successive tracks which overlap each other. This overlap, called the hatch overlap, results in a continuous cycle of rapid melting and resolidification of the metal. The melting of the metal from powder to liquid and subsequent solidification causes anisotropic shrinkage in the layers. The thermal strains caused by the thermal gradients existing between the different layers and between the layers and the substrate leads to considerable thermal stresses in the part. As a result, stress gradients develop in the different directions of the part which lead to distortion and warpage in AM parts. The deformations due to shrinkage and thermal stresses have a significant effect on the dimensional inaccuracies of the final part. A three-dimensional thermomechanical finite element (FE) model has been developed in this paper which calculates the thermal deformation in AM parts based on slice thickness, part orientation, scanning speed, and material properties. The FE model has been validated and benchmarked with results already available in literature. The thermal deformation model is then superimposed with a geometric virtual manufacturing model of the AM process to calculate the form and runout errors in AM parts. Finally, the errors in the critical features of the AM parts calculated using the combined thermal deformation and geometric model are correlated with part orientation and slice thickness.

Frank M. Gerner

Papers

Developing convective heat transfer in deep rectangular microchannels

Microscale energy transport

General film condensation correlations

Effect of Thermal Deformation on Part Errors in Metal Powder Based Additive Manufacturing Processes

A One-Dimensional Model of a Micro Heat Pipe During Steady-State Operation