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Yejun Zhu
Researcher at Nanjing University of Aeronautics and Astronautics
Publications - 42
Citations - 987
Yejun Zhu is an academic researcher from Nanjing University of Aeronautics and Astronautics. The author has contributed to research in topics: Grinding & Abrasive. The author has an hindex of 14, co-authored 41 publications receiving 665 citations. Previous affiliations of Yejun Zhu include Nanjing Agricultural University.
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Review on monolayer CBN superabrasive wheels for grinding metallic materials
TL;DR: A state-of-the-art review on monolayer electroplated and brazed cubic boron nitride (CBN) superabrasive wheels for grinding metallic materials has been provided in this paper.
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Grinding temperature and power consumption in high speed grinding of Inconel 718 nickel-based superalloy with a vitrified CBN wheel
TL;DR: In this paper, the effects of wheel speed vs on grinding temperature and power consumption were investigated, and the minimum grinding forces and specific grinding energy are obtained at vs of 120m/s and the grinding temperature is less than 100°C at this moment.
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Review on grinding-induced residual stresses in metallic materials
TL;DR: In this paper, the authors provide a state-of-the-art review on the investigations into the residual stresses in metallic structural materials generated by grinding, including steels, titanium alloys, and nickel-based superalloys.
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Vibration coupling effects and machining behavior of ultrasonic vibration plate device for creep-feed grinding of Inconel 718 nickel-based superalloy
TL;DR: In this paper, an ultrasonic vibration plate device enabling the longitudinal full-wave and transverse half-wave (L2T1) vibration mode for UVAG was proposed, and the characteristics of coupled vibration in different directions were analyzed on the basis of apparent elastic method and finite element method.
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Brazing of CBN grains with Ag-Cu-Ti/TiX composite filler - The effect of TiX particles on microstructure and strength of bonding layer
TL;DR: In this paper, a detailed investigation on the effects of TiX addition on the microstructure and strength of Ag-Cu-Ti/TiX bonding layer was made based on the evaluation of some fundamental performance.