A
A. Klimpel
Researcher at Silesian University of Technology
Publications - 39
Citations - 197
A. Klimpel is an academic researcher from Silesian University of Technology. The author has contributed to research in topics: Welding & Laser. The author has an hindex of 7, co-authored 39 publications receiving 192 citations. Previous affiliations of A. Klimpel include University of Silesia in Katowice.
Papers
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Journal Article
Diode laser surface modification of Ti6Al4V alloy to improve erosion wear resistance
Aleksander Lisiecki,A. Klimpel +1 more
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The study of properties of Ni–W2C and Co–W2C powders thermal sprayed deposits
TL;DR: In this article, a carbon steel base metal was thermal sprayed by self fluxing cobalt and nickel base alloys (PE 8961 and PE 1229 powders blended with 50 or 60% of tungsten carbides W2C).
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Alloying the X40CrMoV5-1 steel surface layer with tungsten carbide by the use of a high power diode laser
TL;DR: In this article, the effect of alloying with tungsten carbide on properties of the X40CrMoV5-1 steel surface layer, using the high power diode laser (HPDL), is discussed, as well as thickness of the alloying layer, and their influence on structure and chemical composition of the steel.
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The influence of the shielding gas on the properties of a laser-melted surface of austenitic stainless steel
TL;DR: In this article, an experimental investigation on ASTM 304 stainless steel was carried out to determine the influence of surface melting parameters, using a novel diode laser with rectangular and uniform energy distribution across the beam spot, on the shape, penetration depth, structure and microhardness of surface layers.
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The effect of the method and parameters in the GMA surfacing with solid wires on the quality of padding welds and the content of the base material in the overlay
TL;DR: Semi-automatic and automatic GMA methods of overlaying with solid and flux-cored wires are some of the main processes used in the production and regeneration surfacing of machine and equipment elements as mentioned in this paper.