Compositions may be reacted partially to a thermoplastic, elastomeric intermediate stage (B-stage) having excellent shelf stability at room temperature. The thermoplastic (B-stage) compositions may be heated to cure to a thermoset, elastomeric, tack-free final stage (C-stage). The compositions comprise (A) 1 equivalent weight of at least one cycloaliphatic epoxy resin, (B) from about 0.05 to about 0.5 equivalent weight of at least one amine-terminated liquid polymer having a carbon-carbon backbone and (C) from about 0.4 to about 1.5 equivalent weight of at least one anhydride. The compositions are useful as solventless adhesives (alone or compounded with rubber stock or the like) for conveyor belts, hoses, shoes, iron-on clothing patches, and the like. The compositions are also useful as paints, powder coatings, binders for woven or non-woven fibers and cords, and the like.

Thermoplastic, thermosetting elastomeric compositions and methods for making the same

A curable resin composition comprises, in weight percent referring to the total weight of components (a) through (c): (a) 35-75% of a bicyclopentadiene ether epoxy resin, (b) 25-55% of a polyglycidyl ether of phenol-formladehyde novolac resin having an epoxy equivalent weight of 170-210 and a viscosity at 52*C of 1,400-90,000 centipoises, (c) 1-15% of a reactive elastomer selected from the group consisting of a functionally terminated butadiene homopolymer, a functionally terminated butadieneacrylonitrile copolymer and a functionally terminated butadienestyrene copolymer and (d) an aromatic polyamine curing agent in an amount sufficient to provide 0.5-2.0 amino hydrogen atoms of the amine for each epoxy group.

Curable crack-resistant epoxy resin

A method of improving adhesion between the surface of a substrate and a metal deposit electrolessly plated thereon by forming a novel adhesive material layer comprising (A) a rubber material and (B) a thermosetting resin which is present in a proportion defined by the formula 20≦(B)/(A)+(B)≦85 volume %. In the adhesive layer the thermosetting resin is dispersed, in the form of substantially spherical particles of 0.5 to 15μ, in the continuous phase of the rubber material. The method is useful for producing printed circuit boards having a high precision and high accuracy pattern circuit. Further, the method is extremely advantageous when it is applied to the so-called photo-forming process since disappearance of the catalyst nuclei on the circuit pattern image can be eliminated.

Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards

The instant invention provides a coated container device, and method of making the same The coated container device according to the instant invention comprises: (1) a metal substrate; and (2) one or more coating layers associated with the metal substrate, wherein the one or more coating layers are derived from the application of one or more aqueous dispersions to at least one surface of the metal substrate, and wherein the one or more aqueous dispersion comprise: (a) one or more a base polymers; (b) one or more a stabilizing agents; and (c) optionally one or more neutralizing agents, and (d) water

Coated container device, method of making the same

A curable flame retardant epoxy resin composition including (a) at least one flame retardant epoxy resin; (b) at least one amphiphilic block copolymer; and (c) a curing agent. Such components are present in the curable composition in the appropriate amounts and ratios such that, upon curing, the block copolymer self-assembles into a nano structure morphology, such as a worm-like micelle morphology. The resulting cured product made from the composition of the present invention has a remarkably increased high fracture resistance; and allows the use of flame retardant epoxies in applications where fracture resistance is an issue.

Curable flame retardant epoxy compositions

This application relates to curable compositions, based on cycloaliphatic epoxides in admixture with epoxy hardeners and polymers of butadiene, which can be cast into articles of desired configuration or used as binders in the preparation of laminates, and cured at elevated temperatures to form articles characterized by excellent physical properties such as tensile strength, toughness, resistivity to development and propagation of internal cracks, heat distortion temperatures and also characterized by excellent electrical properties.

A. Salensky George

Papers

Curable polyepoxide compositions