The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

Customized polishing pads for cmp and methods of fabrication and use thereof

A pattern forming method includes: (i) forming a film from a chemical amplification resist composition; (ii) exposing the film, so as to form an exposed film; and (iii) developing the exposed film by using an organic solvent-containing developer, wherein the chemical amplification resist composition contains: (A) a resin substantially insoluble in alkali; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a crosslinking agent; and (D) a solvent, a negative chemical amplification resist composition used in the method, and a resist film formed from the negative chemical amplification resist composition.

Pattern forming method, chemical amplification resist composition and resist film

A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.

Spectrum based endpointing for chemical mechanical polishing

Polishing pads with a window, systems containing such polishing pads, and processes that use such polishing pads are disclosed.

Polishing pad with window

A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member

Substrate polishing apparatus

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of giving a polyimide film by a low-temperature process, a pattern forming method using the photosensitive resin composition, and a semiconductor device with a film produced from the photosensitive resin composition. SOLUTION: The photosensitive resin composition for forming a polyimide pattern on a substrate comprises (a) a polyamic acid, (b) a photobase generator which generates a secondary amine having at least one substituent in the α position upon irradiation with an actinic ray, and (c) a solvent. COPYRIGHT: (C)2006,JPO&NCIPI

Photosensitive resin composition, method for producing relief pattern and semiconductor device

A window member (11) having an intentionally designed distribution of refractive index is used, as a transparent window member in a light transmission area of a polishing pad for detecting the end point of polishing by a CMP method. This window member (11) has areas (11 a) having a high refractive index and areas (11 b) having a low refractive index in its window face. In a cross section normal to the window face, the high-refractive index areas (11 a) and the low-refractive index areas (11 b) are alternately arranged in stripes. These areas (11 a and 11 b) in the window face are in a Fresnel zone plate arrangement in which the first area (center circle) is a bright one (area having a high refractive index). A plurality of such Fresnel zone plates (F) are arrayed in a matrix in the window face of the window member (11).

Polishing pad and polisher

PROBLEM TO BE SOLVED: To provide a polishing device and an end point detecting method having high degree of freedom of designing the polishing device and high degree of accuracy of measurement of the film thickness of a wafer SOLUTION: In a polishing device having an end point detecting mechanism for polishing, which is provided with (a) a laser oscillator, (b) a detector, (c) a light transmission path for transmitting the oscillated laser to the surface of a wafer and transmitting a reflected light reflected on the surface of the wafer, or an interference laser beam up to the detector, at least a part of the light transmission path of (c) is formed of multicore type plastic optical fiber

Polishing device with light transmission path

PROBLEM TO BE SOLVED: To provide a method for producing a positive photosensitive resin composition which can ensure a shortened production process and in which the introduction ratio of protective groups introduced into phenolic hydroxyl groups is easily controlled. SOLUTION: The method for producing a positive photosensitive resin composition comprises: bringing a bis-o-aminophenol compound and a dicarboxylic acid compound into a polycondensation reaction; dissolving the resultant polycondensate in a solvent to prepare a solution; introducing tert-butoxycarbonyl groups into at least part of phenolic hydroxyl groups in the polycondensate under a basic catalyst having a boiling point of ≤130°C under 1 atm.; and blending the solution with a photoacid generator capable of generating an acid upon irradiation with an actinic ray. COPYRIGHT: (C)2007,JPO&INPIT

Positive photosensitive resin composition, method for producing the same and relief pattern forming method

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition capable of forming a thick film pattern and giving polybenzoxazole at low temperature. SOLUTION: The positive photosensitive resin composition comprises (A) 100 parts by mass of a polyhydroxyamide having a repeating unit represented by general formula (1), (B) 0.1-10 parts by mass of a sulfonyloxyimino type photoacid generator, (C) 1-50 parts by mass of an acid decomposable compound having a phenolic hydroxy group or a carboxyl group substituted by an acid decomposable group, and (D) 1-20 parts by mass of a thermal acid generator. COPYRIGHT: (C)2008,JPO&INPIT

Akihiko Ikeda

Papers

Photosensitive resin composition, method for producing relief pattern and semiconductor device

Polishing pad and polisher

Polishing device with light transmission path

Positive photosensitive resin composition, method for producing the same and relief pattern forming method

Positive photosensitive resin composition