The performance-limiting effects of thermal breakdown on
ablation-type lithographic printing plates are overcome by
rendering the ink-accepting surface largely impervious to the
effects of debris originating with the surface layer of the
printing member, or by discouraging the formation of harmful
debris altogether In one approach, the ink-accepting surface
is a highly crosslinked polymer The resulting cured matrix
exhibits a sufficient degree of three-dimensional bonding to
resist melting, softening, or chemical degradation as a result
of the imaging process Alternatively, an intervening layer,
disposed between the imaging layer and the surface layer,
prevents the surface layer from undergoing significant thermal
degradation in response to imaging radiation or ablation of the
underlying imaging layer, and is also formulated to produce
little debris or debris having an affinity for ink and/or
fountain solution similar to the affinity of the substrate --eg,
which does not reduce the oleophilicity of the underlying
ink-accepting surface Following imaging, the remnants of the
insulating layer are removed along with the surface layer where
the plate received imaging radiation

Method of lithographic imaging with reduced debris-generated performance degradation and related constructions

Novel fluorinated aromatic polyimide, polyamide and polyamide-imide gas separation membranes and the process of using such membranes to separate one or more gases from a gaseous mixture is disclosed. The polyimides, polyamides and polyamide-imides are formed from diamines of the formula ##STR1## where Ar' is any aromatic diol moiety and X is independently fluorinated alkyl groups having 1 to 6 carbon atoms, most preferably a trifluoromethyl group, m is an integer from 1 to 4, preferably 1.

Fluorinated aromatic polyimide, polyamide and polyamide-imide gas separation membranes

Disclosed is a fluorine-containing polymerizable monomer represented by the formula [1] below. (In the formula [1], a represents an integer of 1-4.) By having a plurality of polymerizable amines in a molecule while containing a hexafluoroisopropyl group, this fluorine-containing polymerizable monomer can be used as an effective polymerizable monomer exhibiting water repellency, oil repellency, low water absorbency, heat resistance, weather resistance, corrosion resistance, transparency, photosensitivity, low refractive index, low dielectric properties and the like, and thus can be applied to the field of advanced polymer materials.

Fluorine-containing polymerizable monomer and polymer compound using same

The present invention provides an aniline derivative represented by the formula (I) wherein R 1 and R 2 are each H, (C 1-12 )alkyl, (C 3-8 )cycloalkyl, hydroxy(C 1-12 )alkyl, hydroxycarbonyl (C 1-12 )alkyl, (C 1-6 )-alkoxycarbonyl(C 1-6 )alkyl, —COR 8 , wherein R 8 is H, halo-(C 1-12 )alkyl, (C 3-8 )cycloalkyl or (substituted) phenyl, COOR 9 , wherein R 9 is a halo(C 1-6 )alkyl group, (substituted) phenyl or (substituted) benzyl; R 3 , R 4 , R 5 , R 6 and R 7 are each H, halogen, OH, nitro, halo(C 1-12 )alkylthio, (substituted) amino-(C 1-2 )alkyl, (substituted) phenyl, (substituted) benzyl, amino, —N(R 10 )R 11 wherein R 10 and R 11 are each H, alkyl, cycloalkyl, (substituted) phenyl, (substituted) benzyl, —COR 8 or COOR 9 , or (C 2-27 )perfluoroalkyl, etc., and a process for producing the aniline derivative. According to the process of the present invention, perfluoroalkylaniline derivatives can be obtained by using various anilines as the substrate with a high position selectivity and high yield.

Perfluoroalkylated aniline compound and process for producing the same

Disclosed is an aromatic diamine compound represented by the formula (I) wherein R is H or CH₃. Also disclosed is a bismaleimide compound represented by the formula (IV) wherein R is H or CH₃, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

Aromatic diamine compounds, bismaleimide compounds, thermosetting resins forming compositions therefrom, resins therefrom, and methods for their preparation

NEW MATERIAL:A fluorine-containing aromatic diamine shown by formula I (R l and R 2 are 1-10C perfluoroalkyl or H and a case wherein R 1 =R 2 =H is omitted). EXAMPLE: 2,2-Bis[(4-amino-2 trifluoromethylphenoxy)phenyl]hexafluoropropane. USE: Useful as a basic component of polyimide, polyamide, etc. A polymer obtained from the diamine has excellent heat resistance, can improve water vapor resistance and reduce permittivity and is extremely useful. PREPARATION: 2,2-Bis(4-hydroxyphenyl)hexafluoropropane is condensed with a nitrobenzene shown by formula II (X is halogen) in an aprotic solvent in the presence of a base to give a dinitro compound shown by formula III. Then the compound shown by formula III is reduced to give a compound shown by formula I. COPYRIGHT: (C)1989,JPO&Japio

Novel fluorine-containing aromatic diamine and production thereof

A fluorine-containing thermosetting resin having a three-dimensional crosslinking structure is obtained by polymerizing a bismaleimide compound having the formula, ##STR1## wherein Rf is fluorine, CF3, C2 F5 or C3 F7. The resin is excellent in moldability, thermal resistance and electric properties, has a low dielectric constant, is hence suitable as a molding material and can be used for molding materials, wiring boards, layer insulation films of LSI, etc.

Fluorine-containing thermosetting resin

NEW MATERIAL:Fluorine-containing phenylenediamine expressed by the formula (Rf is 4-8C perfluoroalkyl). EXAMPLE:Perfluorohexyl-2,5-phenylenediamine. USE:Used as monomer of polycondensation resin such as polyamide or polyimide, or hardener for epoxy resin, etc. Exhibits excellent physical properties such as imparting of water repellency or oil repellency. PREPARATION:Perfluoroalkyliodide is reacted with iodobenzene to obtain perfluoroalkylbenzene. Next, perfluoroalkylaniline is obtained by nitration and reduction, then perfluoroalkylnitroacetoanilide is obtained by acylation and nitration. Further, subjected to reduction and de-acetylation to afford the aimed fluorine-containing phenylenediamine expressed by the formula.

New fluorine-containing phenylenediamine

PURPOSE:To obtain a fluorinated thermosetting resin improved in moldability, heat resistance, and electrical properties and lowered in permittivity by polymer izing the double bond of a specified bismaleimide compound. CONSTITUTION:100 pts.wt. bismaleimide of the formula is mixed with 0.01-5 pts.wt. radical polymerization initiator (e.g. benzoyl peroxide) and optionally a polymerization accelerator, a polymerization retarder, a filler, etc., and the double bond of the bismaleimide is polymerized to obtain a fluorinated thermoset ting resin having a three-dimensional crosslinked structure. This resin is packed into a mold or the like at a temperature in the temperature range of the processing window, heated above a specified polymerization temperature, and is cured by a crosslinking reaction to obtain a low-permittivity insulation mate rial.

Akihiro Fukui

Papers

Novel fluorine-containing aromatic diamine and production thereof

Fluorine-containing thermosetting resin

New fluorine-containing phenylenediamine

Fluorinated thermosetting resin