A
Akira Mishima
Researcher at Hitachi
Publications - 38
Citations - 421
Akira Mishima is an academic researcher from Hitachi. The author has contributed to research in topics: Workflow & Conductor. The author has an hindex of 11, co-authored 38 publications receiving 420 citations.
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Patent
Semiconductor apparatus, power converter and automobile
TL;DR: In this paper, a semiconductor apparatus includes positive and negative side conductors for bridge-connecting semiconductor switches, constituted to a wide conductor, and laminated by sandwiching an insulator between them.
Patent
Power conversion apparatus and mobile object incorporating thereof
Shinji Shirakawa,Akira Mishima,Keiichi Mashino,Toshiyuki Innami,Shinichi Fujino,Hiromichi Anan,Yoshitaka Ochiai +6 more
TL;DR: In this paper, a positive side conductor and a negative side conductor of an input terminal are electrically connected to semiconductor elements, and the output terminal and substrates mounted thereon are arranged in a checkered pattern in a container.
Patent
Power conversion system
TL;DR: In this article, a GP coil was used to suppress high-frequency noise caused by a common mode current in a power conversion system by turning on the same magnetic core to form the GP coil.
Patent
Electric power conversion/inversion apparatus
Osamu Suzuki,Shinji Shirakawa,Akira Mishima,Toshiyuki Innami,Shinichi Fujino,Hideaki Mori,Kenji Takahashi,Keiichi Mashino,Hiromichi Anan +8 more
TL;DR: In this paper, semiconductor chips are disposed, being put between a positive input bus bar 14 p and a negative input bus bars 14 n and plural output bus bars 18 at crossing positions thereof, and are connected electrically and thermally, to the positive input board 14 p in a pole direction consistent therewith while to the negative board 14 n in pole direction inconsistent therewith and further to the common output board 18 in pole directions being different from side by side.
Patent
Semiconductor device and electric power conversion device
TL;DR: In this paper, the first and second pairs of direct current terminals are arranged on one side of one plane of the housing, and at least a portion of the first conductor and of the second conductor as a multilayer structure formed by sandwiching an insulator between them inside the housing.