An outer insulation member made of a first resin packs a part of an anode terminal. The packed part of the anode terminal has a predetermined section. All surfaces of the predetermined section consist of a front surface, a back surface and edges connecting between the front surface and the back surface. The front surface includes a connection area. An anode lead wire is connected to the connection area while being not connected to the anode terminal other than the connection area. The all surfaces of the predetermined section are completely covered with a mask layer made of a second resin except for the connection area. The second resin is different from the first resin in at least one of composition thereof, content of an inclusion, size of an inclusion and shape of an inclusion.

Solid electrolytic capacitor

The present invention relates to the field of solid state capacitors. The invention particularly relates to capacitors of the type in which a powder-formed valve action material, typically tantalum, forms a highly porous anode body portion of a solid state capacitor. According to one aspect of the present invention there is provided a method of manufacturing a solid state capacitor comprising: providing an electrically conducting substrate; forming a plurality of upstanding porous electrically conducting anode bodies on a surface of the substrate, each body electrically connected to the substrate; forming an electrically insulating layer on the exposed surface area provided by the porous bodies; forming a conducting layer on the insulating layer; dividing the substrate into capacitor units, each comprising a portion of substrate provided with a porous capacitive body, and for each unit: providing a cathode terminal in electrical contact with the conducting layer on the capacitive body, providing an anode terminal in electrical contact with the substrate portion, characterised in that the cathode terminal is formed on a surface of the capacitive body distal to the substrate portion and the anode terminal is formed adjacent and substantially co-planar with the cathode terminal, an electrically conducting wick providing electrical contact between the substrate portion and the anode terminal, so that the capacitors have anode and cathode terminals on a common face. By forming a capacitor with anode and cathode connections on a common face the footprint of the capacitor is minimized, whilst facilitating connection with a circuit board.

Solid state capacitors and methods of manufacturing them

Tantalum anode bodies having regions of different density with a lead attached to the region of higher density.

Lead attachment for tantalum anode bodies

A solid electrolytic capacitor is manufactured by screen printing a layer of valve metal powder ink in an array of pads, placing a valve metal pellet on end on each pad, and sintering the resulting assembly to produce an array of porous sintered pellets bonded through a graded density layer to said substrate. Next the assembly is electrolytically anodized to form a valve metal oxide over its surfaces. An insulating polymer may be applied to the substrate around the pellets, and the pellets are impregnated and coated with manganese dioxide. A conductive layer and counterelectrode are applied over the manganese dioxide, and the anodic oxide is removed from the reverse side of the substrate. The array may be separated into individual capacitors.

Solid electrolytic capacitor manufacture

A method of manufacturing a solid electrolyte capacitor, an anode terminal of which is directly attached to a portion of an anode body of porous valve-metal characteristically includes the steps of selectively exposing a predetermined portion of the anode body, and providing the anode terminal to the predetermined portion of the anode body, where the porous valve metal and oxide thereof co-exist, by using conductive material other than the valve-metal of the anode body.

Solid electrolyte capacitor

A SOLID ELECTROLYTE TANTALUM CAPACITOR IS PROVIDED WHEREIN THE WIRE CONNECTION TO THE TANTALUM SINTERED PELLET IS ELIMINATED. A NONPOROUS TANTALUM PAD IS PRESSED OR WELDED TO THE PELLET BODY AND, AFTER ANODIZATION, A ONOWETTING, HIGH-TEMPERATURE RESISTANCE COATING IS APPLIED OVER THE OXIDE FILM COVERING THE PAD. THE COATING ACTS TO MASK THE PAD FROM SUBSEQUENT SEMICONDUCTOR DEPOSITION. AN ANODE CONNECTION CAN THEN BE MADE EITHER BY EXPOSING THE SURFACE OF THE TANTALUM PAD OR BY WELDING THROUGH THE MASKING AND UNDERLYING OXIDE TO THE PAD SURFACE.

Alan G Cooper

Papers

Leadless solid electrolyte tantalum capacitor