A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED arrays are connected to electrodes (32) in inverse parallel. Air-bridge wiring (28) is formed between the LEDs (1) and between the LEDs (1) and electrodes (32). The LED arrays are arranged zigzag to form a plurality of LEDs (1) to produce a high drive voltage and a small drive current. Two LED arrays are connected in inverse parallel, and therefore an AC power supply can be used as the power supply.

Light-emitting device having light-emitting elements

A deposit device (12) cooperating with a fluid source defines a precisely sized drop of fluid (DF) of small diameter on a drop carrying surface (20). Transport mechanism (17) positions the device (12) precisely over the receiving surface (20) and drive mechanism (17) moves the deposit device (12) toward and away from the surface (20). The deposit device (12) is compliant in the direction of deposition motion. When depositing, the deposit device (12) is laterally constrained to a reference position by flexure mounting. A mobile-fluid storage device resupplies the deposit device along the array. Mobile annular storage rings (14) are lowered and raised to obtain a supply of fluid, or a mobile multiwell plate is used. Cleaning mechanism, sampling plans, and array products on microscope slides and fragile or soft membranes are disclosed as are many types of fluids and uses, e.g. in biotechnology, analysis and process control.

Depositing fluid specimens on substrates, resulting ordered arrays, techniques for analysis of deposited arrays

A fluid deposit assembly mounted on a carrier for depositing minute drops of fluid at selected locations upon a substrate, comprising a deposit element having an exposed tip of diameter of 0.3 mm or less constructed and arranged to carry and deposit drops of fluid upon the substrate, stable lateral reference surfaces or surface portions exposed for engagement by the deposit element, the surfaces or surface portions being constructed and arranged to prevent X, Y displacement of the deposit element relative to the carrier when the deposit element is urged thereagainst and design for urging the deposit element against the reference surfaces or surface portions at least at the time that the deposit element approaches a substrate to deposit a fluid drop. The reference surfaces or surface portions and the design for urging are cooperating to precisely position the deposit tip in a precisely desired position as it contacts the substrate. The deposit element is shown as the tip of an axially moveable pin. The reference surface portion is shown, among others, as a surface of revolution whose axis is disposed at a predetermined position relative to the carrier. A mobile supply in the form of a multiwell plate is moved under computer control to be a close companion of the deposit device, enabling rapid deposit action and avoidance of evaporative effects that can alter the consistency of dots in the array being formed. The device can deposit one dot on top of another from fluid in a mobile multiwell plate that moves to be close to the deposit device.

Depositing fluid specimens on substrates, resulting ordered arrays, techniques for deposition of arrays

A computer controlled system for high speed surface mount adhesive placement in circuit board production includes a dot generator supported for motion along the X, Y and Z axes. The dot generator ejects a jet of viscous adhesive that breaks away from the nozzle of the dot generator as a result of its own forward momentum. The system includes an automatic circuit board conveyor with adjustable width and pneumatically operated lift and lock mechanisms. The system runs through a self-diagnostic set-up procedure and dot calibration routine. Dot size and location are monitored through a video camera and vision circuit. A computer interfaces with the vision circuit and with motion, dot generator and conveyor controllers so that the system can operate in a high volume production assembly line. Application programs are executed by the system computer typically utilizing CAD data from a disk or a computer integrated manufacturing (CIM) controller. The system automatically assigns dot sizes to specific components based on user specifications or a component library. Dot placement paths are optimized by aligning the in-line points.

Computer controlled viscous fluid dispensing system

A wash station assembly and method for washing selected samples in a sample containing assembly. The wash station assembly includes a wash station having a frame and a fluid dispensing assembly connected to the frame. The fluid dispensing assembly has a selector valve that is connectable to a plurality of fluid lines and is adjustable to allow only one of the fluids to pass through the selector valve at a time. An array of syringes is coupled to the selector valve and positioned to receive the fluid passing through the selector valve. Each syringe includes a check valve that prevents backflow of fluid or air into the syringe through the pipetting needles. A distribution manifold is connected to the selector valve and receives the fluid passing through the selector valve. The manifold has a plurality of distribution channels coupled to the syringes, to direct the fluid into the syringes. Each distribution channel has a manifold valve therein that prevents backflow of fluid into the manifold from the syringes. An array of pipetting needles is connected to the syringes and is positioned to direct the fluid into the sample containing assembly for washing the samples. The pipetting needles have a radially directed opening in the distal end to direct the fluid radially away from the needle during the dispensing process. A waste management system is connected to the wash station to automatically separate halogenated waste fluids from non-halogenated waste fluids.

Sample wash station assembly

A material (21) is transferred to an electronic component (32) using a transfer apparatus (10). The transfer apparatus (10) has pins (13) that pass through openings (19) in a cavity plate (16). The pins (13) and the openings (19) in the cavity plate (16) form cavities (20) that are filled with the material (21). The pins (13) are then extended from the cavity plate (16) to transfer the material (21) from the cavities (20) to the electronic component (32).

Material transfer apparatus and method of using the same

An optical coupler (60) includes of an optical connector (10) coupled to an optoelectric board (64). An optical fiber (50) is inserted into the optical connector (10). The optical fiber (50) is bent to an angle of approximately 90° inside the optical connector (10). A tip (55) of the optical fiber (50) is substantially perpendicular to the optoelectric board (64) and aligned to an optical region of an optoelectric device (62) on the optoelectric board (64). A portion of the optical fiber (50) outside the optical connector (10) is substantially parallel to the optoelectric board (64). A fiber retainer (30) secures the optical fiber (50) to the optical connector (10).

Optical coupler and method for coupling an optical fiber to an optoelectric device

Two partial cylindrical, externally pressurized static air bearings are used to provide a self aligning air bearing platform. The self aligning air bearing platform is useful in a tape automated bonding system to bond a semiconductor device having a high pin count. A bottom bearing block has a top surface in the shape of an arc and at least one air outlet. A middle bearing block has a bottom surface configured to mate with the top surface of the bottom bearing block. The middle bearing block also has a top surface in a shape of an arc which is rotated 90° with respect to the arc shaped top surface of the bottom bearing block and at least one air outlet. A top bearing block mates with the middle bearing block and provides the platform for holding the semiconductor device. Air bearings between the moving bearing blocks provide a low friction bearing for the aligning platform.

Self aligning air bearing platform

A method of manufacturing a semiconductor component includes forming a vertical side seal for a runner in a first mold plate by mating a protrusion of the first mold plate with a protrusion of a second mold plate. As an encapsulating material is forced through the runner, the vertical side seal prevents an encapsulating material from leaking out of the edge of the runner.

Method of manufacturing a semiconductor component

A dispenser (10, 32) that provides accurate control of the material dispensed has an upper adjuster (27) which is used to adjust the distance that the dispenser's (10, 32) plunger (23) is withdrawn from the dispenser's (10, 32) material reservoir (17), and a separate lower adjuster (28) to adjust the distance that the plunger (23) is inserted into the cavity (17) to dispense the material. The dispenser (10, 32) also includes a nozzle (16) and a nozzle plate (14, 14') that are formed from a dimensionally stable material in order to provide accurate control of the dispensing rate and the position of the nozzle. These features facilitate utilizing the dispenser (10, 32) as a portion of a multiple nozzle dispenser system (32) that accurately controls the rate at which material is emitted.

Albert J. Laninga

Papers

Material transfer apparatus and method of using the same

Optical coupler and method for coupling an optical fiber to an optoelectric device

Self aligning air bearing platform

Method of manufacturing a semiconductor component

Accurately controlled fluid dispenser with upper and lower stroke adjusters