A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

A method and apparatus for cooling a rotating anode X-ray tube. An electromagnetic motor is provided to rotate an X-ray anode with cooling passages in the anode. These cooling passages are coupled to a cooling structure located adjacent the electromagnetic motor. A liquid metal fills the passages of the cooling structure and electrical power is provided to the motor to rotate the anode and generate a rotating magnetic field which moves the liquid metal through the cooling passages and cooling structure.

Cooling for a rotating anode X-ray tube

A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the surface from environmental corrosion due to water or moisture. The alkali silicate glass material is doped with a first element to affect various forms of radiation passing through the coating. The electromagnetic radiation is at least one of ultraviolet, x-ray, atomic (gamma, alpha, beta), and electromagnetic or radio wave radiation. The coating may also be used to protect a solar cell from the environment and UV rays while retransmitting received light as usable light for conversion into electrical energy. The coating may also be used to prevent whisker formation in metal finishes of tin, cadmium, zinc, etc.

Alkali silicate glass based coating and method for applying

A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.

System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling

The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.

Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid

A heat exchanger and electromagnetic pump assembly is disclosed as comprising a heat exchanger including a housing for defining an annularly shaped cavity and supporting therein a plurality of tubes. An electromagnetic pump is disposed beneath the heat exchanger and is comprised of a plurality of flow couplers disposed in a circular array. Each flow coupler is comprised of a pump duct for receiving primary liquid metal, and a generator duct for receiving an intermediate liquid metal. A downcomer tube is disposed centrally of the assembly and passes through the annularly shaped cavity and the array of flow couplers to discharge the intermediate fluid into a first plenum chamber. The first plenum chamber is disposed in communication with the generator ducts of all of the flow couplers, thus permitting the intermediate liquid metal to flow upward therethrough. The generator ducts exit their flows of the intermediate liquid metal in common to a second plenum chamber, which is disposed in communication with the annularly shaped cavity to permit the flow of the intermediate liquid metal therethrough, whereby the intermediate liquid metal is heated by the flow of the primary liquid metal through the tubes. A third plenum chamber receives collectively the flows of the primary liquid metals from the tube and for directing the primary liquid metal to the pump ducts of the flow couplers, whereby a force is exerted on the primary liquid metal, pumping it through the pump ducts.

Alexion Christopher Constantin

Papers

Pump/intermediate heat exchanger assembly for a liquid metal reactor

Ensemble de pompe/echangeur de chaleur intermediaire pour un reacteur nucleaire refroidi par un metal liquide