Electronic components are shielded from electromagnetic interference (EMI) by one or more conformal layers filled with selected filler particulars for attenuate specific EMI frequencies or a general range of frequencies. Shielding is accomplished through the use of a single general purpose shielding layer, or through a series of shielding layers for protecting more specific EMI frequencies. In a multilayer embodiment, a semiconductor device (50) is mounted on a printed circuit board substrate (16) as a portion of an electronic component assembly (10). A conformal insulating coating (24) is applied over the device to provide electrical insulation of signal paths (e.g. leads 54 and conductive traces 18) from subsequently deposited conductive shielding layers. One or more shielding layers (60, 62, and 64) are deposited, and are in electrical contact with a ground ring (56). In a preferred embodiment, the ground connections for the shield layers are separate from those used for power distribution within the devices.

Shielded electronic component assembly and method for making the same

The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.

EMI shielding for electronic component packaging

An electrically continuous conformal EMI protective shield for adhering directly to and conforming with surfaces of a printed circuit board is disclosed. The conformal EMI shield includes a thermally conductive dielectric coating adhering directly to surfaces of the printed circuit board to provide an electrically nonconductive, thermally conductive, contiguous coating that covers all such printed circuit board surfaces. The conformal EMI shield also includes a conductive coating adhering directly to surfaces of the dielectric coating to provide an electrically conductive layer that prevents electromagnetic emissions from passing through the conformal EMI protective shield.

Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating

A compliant hydrodynamic fluid film journal bearing for handling high loads. The bearing assembly includes a first thin smooth compliant sheet for facing a shaft, one or more corrugated foils, and a second sheet between the foils and the compliant sheet for supportedly underlying the compliant sheet for preventing sagging of the first sheet between ridges of the foils. A foil element is anchored at a position intermediate its ends to the bearing sleeve whereby both ends thereof are unanchored. A pair of radially outer and inner corrugated foils have outer foil ridges which underlie some inner foil ridges and outer foil furrows which underlie others of the inner foil ridges. A bearing assembly includes a plurality of rows of corrugated foil elements wherein ends of foil elements are offset circumferentially from ends of foil elements in adjacent rows symmetrically from the radial centerplane to provide a herringbone pattern effect. At least some ridges on at least one of inner and outer corrugated foils have truncated apex portions.

High load capacity compliant foil hydrodynamic journal bearing

Multi-layered moldings and methods for manufacturing multi-layered moldings. A metallized layer (40) can be deposited on at least one side of a substrate (38). The substrate (38) can be shaped and then the metal layer (40) can be deposited onto the shaped substrate (38). Optionally, an injection molded resin (43) can be deposited onto the substrate (38) and/or metal layer (40).

Multi-layered structures and methods for manufacturing the multi-layered structures

An electromagnetically shielded self-molding package for an electronic component comprises a pair of bags having an electrically conductive coating therebetween and disposed about the component and having a polymerizable resin completely filling the space between the bags and the component.

Shielded self-molding package for an electronic component

A compliant foil bearing comprises a relatively thin bearing foil that is supported in juxtaposed relation to both a shaft and a bearing housing by a pair of sinusoidally folded spacer foils.

Compliant foil bearing

A method and package for protecting an electronic component (10) from the environment comprises providing at least one bag (22) made from thermoplastic heat shrink material, inserting the electronic component (10) into the bag (22), injecting a liquid polymerizable resin (38) into the bag (22), heating the bag (22) to shrink it about the electronic component (10) and the resin (38), and curing the resin (38). Precalculated shrink of the thermoplastic wrap over a measured amount of resin (38) results in minimum material usage, and in a light weight, self tooled, rigid assembly. The resulting cured shape of the molded self tooled assembly will be largely determined by the shape of the electronic circuit components (16, 18, 20) mounted to the electronic component (10). Thus, the final cured shape need not be governed or altered by subsequent tooling or processing. Conductive shielding around the electronic components is provided between a plurality of layers, or bags, of shrink wrap.

Self tooling, molded electronics packaging

An adjustable tension foil bearing for a rotatable shaft comprises a bearing housing for the support of a plurality of foil carriers which carry a like plurality of foil elements. The foil carriers are rotatable to effect tensioning of the foil elements.

Adjustable tension foil bearing

A spring support system for a compliant hydrodynamic gas lubricated bearing comprises a plurality of cylindrical spring elements that are retained by floating control rods in circumferential and axially extending arrays for the support of a compliant foil.

Allen M. Jones

Papers

Shielded self-molding package for an electronic component

Compliant foil bearing

Self tooling, molded electronics packaging

Adjustable tension foil bearing

Interlocking cylinder compliant hydrodynamic gas bearing