Recent development of polymer electrolyte membranes for fuel cells.

Modern computer microprocessor chips are marvels of engineering complexity. For the current 45 nm technology node, there may be nearly a billion transistors on a chip barely 1 cm2 and more than 10 000 m of wiring connecting and powering these devices distributed over 9-10 wiring levels. This represents quite an advance from the first INTEL 4004B microprocessor chip introduced in 1971 with 10 μm minimum dimensions and 2 300 transistors on the chip! It has been disclosed that advanced microprocessor chips at the 32 nm node will have more than 2 billion transistors.1 For instance, Figure 1 shows a sectional 3D image of a 90 nm IBM microprocessor, containing several hundred million integrated devices and 10 levels of interconnect wiring, designated as the back-end-of-the-line (BEOL). Since the invention of microprocessors, the number of active devices on a chip has been exponentially increasing, approximately doubling every two years. This trend was first described in 1965 by Gordon Moore,2 although the original discussion suggested doubling the number of devices every year, and the phenomenon became popularly known as Moore’s Law. This progress has proven remarkably resilient and has persisted for more than 50 years. The enabler that has permitted these advances is known as scaling, that is, the reduction of minimum device dimensions by lithographic advances (photoresists, tooling, and process integration optimization) by ∼30% for each device generation.3 It allowed more active devices to be incorporated in a given area and improved the operating characteristics of the individual transistors. It should be emphasized that the earlier improvements in chip performance were achieved with very few changes in the materials used in the construction of the chips themselves. The increase of performance with scaling * Corresponding author. E-mail: gdubois@us.ibm.com. † IBM Almaden Research Center. ‡ Stanford University. Willi Volksen received his B.S. in Chemistry (magna cum laude) from New Mexico Institute of Mining and Technology in 1972 and his Ph.D. in Chemistry/Polymer Science from the University of Massachusetts, Lowell, in 1975. He then joined the research group of Prof. Harry Gray/Dr. Alan Rembaum at the California Institute of Technology as a postdoctoral fellow and upon completion of the one-year appointment joined Dr. Rembaum at the Jet Propulsion Laboratory as a Senior Chemist in 1976. In 1977 Dr. Volksen joined the IBM Research Division at the IBM Almaden Research Center in San Jose, CA, where he is an active research staff member in the Advanced Materials Group of the Science and Technology function.

Low dielectric constant materials.

The present invention is directed to a method of and a mold (14) for arranging features on a substrate (12) to replicate the features with minimal dimensional variability. The method includes arranging features on a layer to minimize thickness variations in the layer that are attributable to density variations of the plurality of features on the layer. The features are transferred into an underlying substrate (12). It is believed that by forming the features so as to define a uniform fill factor in the layer, the thickness variations may be reduced, if not abrogated. To that end, one method in accordance with the present invention includes forming a flowable material (24) on the substrate (12). Thereafter, a plurality of features is formed in a region of the flowable material (24). The plurality of features are arranged to provide a substantially uniform fill factor in the region.

A method and a mold to arrange features on a substrate to replicate features having minimal dimensional variability

The present invention is directed to a material for use in imprint lithography that features a composition having a viscosity associated therewith and including a surfactant, a polymerizable component, and an initiator responsive to a stimuli to vary the viscosity in response thereto, with the composition, in a liquid state, having the viscosity being lower than about 100 centipoises, a vapor pressure of less than about 20 Torr, and in a solid cured state a tensile modulus of greater than about 100 MPa, a break stress of greater than about 3 MPa and an elongation at break of greater than about 2%.

Materials for imprint lithography

One embodiment of the present invention is a method for generating patterned features on a substrate that includes: (a) forming a first layer on at least a portion of a surface of the substrate, the first layer comprising at least one layer of a first material, which one layer abuts the surface of the substrate; (b) forming a second layer of a second material on at least a portion of the first layer, which second layer is imprinted with the patterned features; (c) removing at least portions of the second layer to extend the patterned features to the first layer; and (d) removing at least portions of the first layer to extend the patterned features to the substrate; wherein the first layer and the second layer may be exposed to an etching process that undercuts the patterned features, and the first material may be lifted-off.

Methods for fabricating patterned features utilizing imprint lithography

Protective carbon layer for chemical corrosion of stainless steel

Micro-machine fabrication using diamond-like carbon films

Influence of the plasma parameters and nitrogen addition on the electrical characteristics of DLC films deposited by inductively coupled plasma deposition

Diamond-like carbon (DLC), also known as amorphous hydrogenated carbon (a-C:H), are a class of materials with excellent mechanical, tribological and biological properties. When the DLC films are enhanced with other elements, all of these properties can be changed within a certain range. In this work, reactive magnetron sputtering was used to deposit W-DLC (hydrogenated tungsten carbide) films on Ti6Al4V (implant material). Many films were made using pure tungsten (99.99%) target and different plasmas processes, with different ratio among argon and methane. It was possible to change the films composition (from pure amorphous carbon to carbon enhanced with tungsten) according to ratio of argon and methane plasma. Between all films processed, the carbon films enhanced with tungsten showed good results in the “in vitro” cytotoxicity testing. Raman spectroscopy was used to analyze the chemical bonds kinds and the chemical bonds quantities. The Rutherford Back Scattering (RBS) was used to analyze the films compositions. The chemical inertness was analyzed by scanning voltametry. W-DLC thin films obtained in these processes have low roughness, high chemical resistance, good adhesion and show a high biocompatibility, when compared with common DLC thin films. Hence we have concluded that the tungsten concentrations in the DLC films make an important role to improve the properties of the DLC layers.

Ana Paula Mousinho

Papers

Protective carbon layer for chemical corrosion of stainless steel

Micro-machine fabrication using diamond-like carbon films

Influence of the plasma parameters and nitrogen addition on the electrical characteristics of DLC films deposited by inductively coupled plasma deposition

Use of diamond-like carbon with tungsten (W-DLC) films as biocompatible material

Nanostructured diamond-like carbon films characterization