The semiconductor device includes (A) a first MOS transistor including (a) a main surface at a part of which recesses are formed, an inner surface of the recesses defining a crystal plane being able to be thermally oxidized at higher speed than the main surface, and (b) an insulator formed on the inner surface of the recesses, the inner surface of the recesses working as a channel region and the insulator working as a gate insulator in the first MOS transistor, and (B) a second MOS transistor in which the main surface works as a channel region and an insulator formed on the main surface works as a gate insulator, the gate insulator of the first MOS transistor having a greater thickness than that of the gate insulator of the second MOS transistor. Thus, above the thinner gate insulator is formed the second MOS transistor, while above the thicker gate insulator is formed the first MOS transistor having a higher breakdown voltage than that of the second MOS transistor. Thus, the number of steps for forming insulators having different thicknesses can be reduced relative to prior methods. In addition, a resist layer is not directly deposited on a gate insulator unlike prior methods, a gate insulator is not contaminated with impurities.

Method of forming MOS transistors having gate insulators of different thicknesses

In a memory device of an SRAM, a threshold voltage (Vthn) of each driving MOS transistor consisting of the N-type MOS transistor is set larger than a threshold voltage (Vthp) of each MOS transistor for selecting an address consisting of the P-type MOS transistor.

Semiconductor memory device and method of manufacturing the same

The invention includes a semiconductor construction having a pair of channel regions that have sub-regions doped with indium and surrounded by boron. A pair of transistor constructions are located over the channel regions and are separated by an isolation region. The transistors have gates that are wider than the underlying sub-regions. The invention also includes a semiconductor construction that has transistor constructions with insulative spacers along gate sidewalls. Each transistor construction is between a pair source/drain regions that extend beneath the spacers. A source/drain extension extends the source/drain region farther beneath the transistor constructions on only one side of each of the transistor constructions. The invention also includes methods of forming semiconductor constructions.

Methods of forming semiconductor constructions

A semiconductor static memory cell with two cross-coupled inverters and two transmission gates for coupling two bit lines uses all minimum size (gate length and gate width) MOSFETs to achieve minimum area. This minimum dimension is rendered possible by using a higher threshold voltage for the transmission gate MOSFET than the threshold voltage of pull-down MOSFET of the inverter. Different threshold voltages are obtained with selective ion implantation, different gate oxide thicknesses and/or different gate doping.

Minimum size integrated circuit static memory cell

A gate insulating film in a memory cell portion is thicker than a gate insulating film in a peripheral circuitry. Source/drain of an MOS transistor in the memory cell portion have double-diffusion-layer structures, respectively, and source/drain of an MOS transistor in the peripheral circuitry have triple-diffusion-layer structures, respectively.

Integrated circuit having a memory cell transistor with a gate oxide layer which is thicker than the gate oxide layer of a peripheral circuit transistor

A static memory device has memory cells each having a pair of driver MOSFETs, two load resistors each connected between a power source and a drain of each of the driver MOSFETs, two access MOSFETs each of which is connected between the drain of each of the driver MOSFETs and each of bit lines and gates of which are connected to a word line. In the memory cell, the thickness of a gate oxide film of the access MOSFET is made thicker than that of the gate oxide film of the driver MOSFET. The operation stability of the memory cell is enhanced, without the need of increasing a chip size, by increasing a ratio between the driver MOSFETs and the access MOSFETs of the memory cell (the ratio of current supplying capabilities of the two transistors) without making a gate size large or without making it so small as to cause process variations.

Ando Manabu

Papers

High stability static memory device having metal-oxide semiconductor field-effect transistors