A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region The semiconductive layer is provided in the second region

Wired circuit board

An electrically continuous conformal EMI protective shield for adhering directly to and conforming with surfaces of a printed circuit board is disclosed. The conformal EMI shield includes a thermally conductive dielectric coating adhering directly to surfaces of the printed circuit board to provide an electrically nonconductive, thermally conductive, contiguous coating that covers all such printed circuit board surfaces. The conformal EMI shield also includes a conductive coating adhering directly to surfaces of the dielectric coating to provide an electrically conductive layer that prevents electromagnetic emissions from passing through the conformal EMI protective shield.

Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating

The charging of spacecraft components by high energy radiation can result in spontaneous pulsed discharges. The pulses can interrupt normal operations of spacecraft electronics. The 20-year history of ground studies and spacecraft studies of this phenomenon are reviewed. The data from space are not sufficient to unambiguously point to a few specific solutions. The ground based data continue to find more problem areas the longer one looks. As spacecraft become more complex and carry less radiation shielding, the charging and discharging of insulators is becoming a more critical problem area. Ground experiments indicate that solutions for spacecraft are multiple and diverse, and many technical details are reviewed or introduced here.

Upsets related to spacecraft charging

The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.

Radiation shielding of three dimensional multi-chip modules

The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.

Methods and compositions for ionizing radiation shielding

A semi-insulating coating or surface layer is applied over insulating materials such as a circuit board or wiring harness or feedthrough insulator. The paint is electrically fixed to ground and as a result leaks away charge buildup before large pulse discharges occur. For example, pure tin oxide particles in phenoxy resin binder forms a paintable application for the invention.

Arthur R. Frederickson

Papers

Process and apparatus for preventing the pulse discharge of insulators in ionizing radiation