Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, and the protrusions comprise non-spherical thermally conductive particles substantially aligned in the direction of the major dimension within the protrusions. A thermal interface material may be provided contiguous with the base. Also provided is a flexible heat sink article comprising a base comprising a polymer and having a first surface and a second surface, a plurality of polymeric protrusions extending away from the first surface of the base, each protrusion having a major and a minor dimension, and a metallic layer contiguous with the second surface of the base, wherein the base and the protrusions comprise thermally conductive particles. Also provided is a method of making a flexible heat sink.

Flexible heat sink

The present invention is directed to a process of forming a package for enclosing an electrical device wherein the enclosure contains a very low amount of oxygen and water vapor. The package includes a base and lid components bonded together by a sealing glass. The lid component contains a gettering alloy from which the oxide layer is removed prior to the final sealing of the package. The gettering alloy forms a refractory oxide layer under an oxide layer formed with the primary constituent of the alloy.

Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor

A high density electronic circuit for use in an implantable stimulation device that comprises a flexible substrate that has the advantage of integrating “chip-and-wire” microelectronic circuits and flexible interconnections that are adapted to conform to the body compatible housing into a single structure. The flexible substrate has die attach pads, each die attach pad having a set of wire bond pads therearound, each wire bond pad being connected to conductors formed within the substrate according to circuit function. A plurality of chip-and-wire integrated circuit (IC) chips are mounted by epoxy die attachment on the die attach pads, each IC chip has a plurality of contact pads formed on a top surface thereof, and gold wire bonds electrically connect the plurality of contact pads to the wire bonds pads. The wire bonds include a primary bond and, optionally, a safety bond for reinforcement. Other techniques are disclosed to enable the use of the gold wire bonds on a flexible substrate.

Implantable medical device construction using a flexible substrate

A semiconductor chip module includes semiconductor chips each of which has contacts on its entire front face. A multi-layered organic circuit board having a small dielectric constant is provided for mounting the semiconductor chips. Intermediate ceramic substrates having the same thermal expansion coefficient as that of the semiconductor chip, are also provided. Each such intermediate ceramic substrate has contacts on its front and back faces corresponding to those of the semiconductor chip. These contacts are electrically connected directly in a one-to-one relationship. The contacts on the semiconductor chip and the corresponding ones on the front face of the intermediate ceramic substrates are connected by solder. The contacts on the back face of the intermediate ceramic substrate and the corresponding contacts on the front face of the multi-layered ceramic circuit board are connected by respective conductive pins having a predetermined flexibility and rigidity through a predetermined gap therebetween. With this arrangement, the relative displacement due to a thermal expansion difference between the intermediate ceramic substrate and the multi-layered organic circuit board is permitted without causing substantial stress thereon.

Semiconductor chip module

The body has heat removing or heat supplying cooling units (7) in a single-piece manner, where the cooling units are channels, rips and recesses that are subjected with heating or cooling medium e.g. gas and fluid such as water or oil. The units are sintered with the body, where the body and/or the units have a ceramic component. The units are connected with the body in a spatial orientation. The set of components emitting light are connected with the body.

Carrier body for components or circuits

high density and electrically insulating sintered body 11 has SiC as its principal component and as an electro-conductive thin layer 17 on a desired surface thereof. To achieve good bonding the electro-conductive thin layer is a metallized layer containing at least one metal selected from Group Ib and VIII metals and their alloys and a binder forming a vitreous matter with a silicon oxide, and is bonded to said sintered body via a fused layer formed between a silicon oxide film formed on the surface of said sintered body 11 and the oxide of said binder. The invention can be applied to a semiconductor device using an electrically insulating silicon carbide sintered body as the substrate.

Asai Osamu

Papers

Sic sintered body having metallized layer and production method therefor