The invention is concerned with the electrodeposition of copper from an aqueous acidic bath containing the following additives: a. An alkylated polyalkyleneimine obtained as the reaction product of a polyalkyleneimine represented by the formula : H.sub.2 N--(CH.sub.2).sub.n NH--R wherein R is H or (CH 2 ) n NH 2 and n=1 to 6 with an epihalohydrin and an alkylating agent; an organic sulfo sulfonate; a polyether; and optionally a thioorganic compound.

Acid copper electroplating baths containing brightening and leveling additives

An aqueous acidic plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described. The plating baths are free of fluoride and fluoborate ions and comprise (A) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (B) at least one alkane sulfonic acid or alkanolsulfonic acid, (C) at least one surfactant, (D) an effective amount of at least one primary brightening agent selected from the group consisting of halogen substituted and dialkoxy and trialkoxy substituted benzaldehydes, (E) an effective amount of a secondary brightening agent which is at least one lower aliphatic aldehyde, and (F) an effective amount of an auxiliary brightening agent which is at least one of the group consisting of aniline and the amino-, carboxy-, halo-, alkyl- or alkoxy-substituted anilines. Methods for the electrodeposition of tin, lead, or tin-lead alloys from such baths also are described.

Plating bath and method for electroplating tin and/or lead

Compositions and processes for electrolytic plating. The compositions are characterized by critical amounts of one or more brightening and leveling agents. The compositions are particularly useful for plating through hole walls of printed circuit boards, including through holes having an aspect ratio equal or greater than about ten to one.

Copper electroplating solutions and processes

This work reports the effects of four organic compounds (referred to as levelers) on the electrodeposition of Zn on steel from alkaline free-cyanide electrolytes. The additives tested included polyvinylalcohol (PVA) and the condensation products of epichlorhydrin with amines, called polyamines (PAs), that were synthesized using an aliphatic amine (PA-I, from diethylamine and PA-II from diethylamine-triethylamine), and a heterocyclic quaternary imidazolium molecule (PA-Imid, from imidazole). These compounds were evaluated in the absence and in addition to a quaternary ammonium brightener, N-benzyl-3-carboxylpyridinium chloride (3NCP). The imidazole derivative-based polyamine (PA-Imid) causes greater inhibition of the zinc reduction process than the aliphatic polyamine, and more cathodic overpotential is necessary to promote massive metal deposition. The morphology of the deposits is modified when polyamines are added to the bath; more compact and smaller crystals are obtained with PVA as well as with polyamine PA-I. The addition of PA-II as well as PA-Imid yields crystals growing perpendicular to the substrate. The addition of 3NCP with PVA, PA, or PA-Imid increased the deposition overpotential and modified the morphology by diminishing the grain size. In the absence of additives, crystallographic orientation favored the basal Zn(002) with high atomic packing. The addition of the levelers favored the high-angle pyramidal Zn(101) with low atomic packing. The combination of the levelers with (3NCP) favored the prismatic Zn(100) crystallographic orientation. Additives decrease the size of zinc crystals and tend to increase the energy of lattice favoring the growth of pyramidal and prismatic planes.

Effects of organic additives on zinc electrodeposition from alkaline electrolytes

A method and apparatus for purifying water includes a pump and purification cell, the cell having two electrodes, at least one of which electrodes is approximately 92 percent copper, 3 percent silver and 5 percent nickel, by weight. An electrical potential is developed between the electrodes and caused to alternate in polarity to prevent plating. Copper and silver ions are released into the water at adjustable rate, where they cooperatively destroy bacteria, algae, and the like.

Method and apparatus for purification of water

Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

Limiting tin sludge formation in tin or tin/lead electroplating solutions

Electroplating baths for hard bright gold deposits

This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.

Bath and process for plating lead and lead/tin alloys

Bath and process for plating tin, lead and tin-lead alloys

A bath for the electrodeposition of bright tin-lead alloys which comprises an aqueous acidic bath containing at least one soluble tin compound and one soluble lead compound to which there has been added: A. a lower alkylene oxide condensation product, and B. an effective amount of at least one pyridine or quinoline compound having the structure ##STR1## wherein the substituents R1, R2, R3, R4 and R5 each is a hydrogen or halogen atom, a lower alkyl radical containing a hydroxyl group, an alkenyl radical, the radical (Cn H2n --CO2 H in which n has a value from 0 to 6 or a carbamide radical or R4 and R5 combined form a divalent radical to provide a compound having the structure ##STR2## in which R6 is nothing or a hydroxyl radical; Z is nothing, 0- or a quaternary ammonium forming hydrocarbon radical provided that when Z is nothing, at least one of the substituents R1, R2, R3, R4 and R5 is a halogen atom, a lower alkyl radical containing a hydroxyl group, an alkenyl radical, the radical (Cn H2n --CO2 H in which n has a value from 0 to 6 or a carbamide radical or R6 is a hydroxy radical; and X is nothing or when Z is a quaternary ammonium forming hydrocarbon radical X is an anion. The invention also includes the addition of an aromatic aldehyde in combination with pyridine or quinoline compounds and the alkylene oxide condensation product which results in the production of even brighter to brilliant deposits over a wide current density range.

Barnet D Ostrow

Papers

Limiting tin sludge formation in tin or tin/lead electroplating solutions

Electroplating baths for hard bright gold deposits

Bath and process for plating lead and lead/tin alloys

Bath and process for plating tin, lead and tin-lead alloys

Electrodeposition of tin, lead and tin-lead alloys