B
Bennett A. Joiner
Researcher at Motorola
Publications - 7
Citations - 299
Bennett A. Joiner is an academic researcher from Motorola. The author has contributed to research in topics: Die (integrated circuit) & Heat sink. The author has an hindex of 6, co-authored 7 publications receiving 299 citations.
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Patent
Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation
TL;DR: In this paper, a semiconductor device having a heat sink is provided in which an opening through the heat sink enables a vacuum source to be applied to the mounted surface of the semiconductor die.
Patent
Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation
TL;DR: In this paper, a method for making a semiconductor device having a heat sink is provided in which an opening through the heat sink enables a vacuum source to be applied to the semiconductor die mounting surface.
Patent
Low profile semiconductor device with like-sized chip and mounting substrate
TL;DR: A low profile semiconductor device is manufactured by mounting a semiconductor die onto a substrate (28) using an interposer (30), which couples an active surface (32) of the die to conductive traces (33) on the top surface of the substrate.
Patent
Drop-in heat sink package with window frame flag
TL;DR: In this paper, a molded semiconductor device with a reduced die-to-flag interface and a drop-in heat sink is proposed to reduce the interfacial contact area between the die and the flag.
Patent
Method of fabricating a thermally enhanced lead frame
TL;DR: In this paper, a semiconductor die is mounted upon a downset X-shape die support of a lead frame and thermal bars are attached to the tie bars to dissipate the heat from the die into the nearby lead tips so that the heat can be conducted out of the package body through the thermally conductive lead frame.