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Design Of Analog Cmos Integrated Circuits

Organic light emitting devices are disclosed which are comprised of a heterostructure for producing electroluminescence wherein the heterostructure is comprised of an emissive layer containing a phosphorescent dopant compound. For example, the phosphorescent dopant compound may be comprised of platinum octaethylporphine (PtOEP), which is a compound having the chemical structure with the formula:

OLEDs doped with phosphorescent compounds

Electromagnetic Metamaterials: Transmission Line Theory and Microwave Applications. By Christophe Caloz and Tatsuo Itoh.

Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.

Semiconductor chip assemblies, methods of making same and components for same

An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Contact carriers (tiles) for populating larger substrates with spring contacts

A method for attaching an array of flexible leads to the bottom of an integrated circuit package. There is provided a sheet of electrically conductive material. A plurality of slots are punched into the sheet, such that there is formed a plurality of beams. The beams are then bent into a spring shape. The sheet is placed over an integrated circuit package which has an array of contact pads extending across a bottom surface of the package. The beams are aligned and attached to the contact pads. The beams are then cut and separated from the remainder of the sheet. The sheet is removed, wherein there is constructed an integrated circuit package that has a two dimensional array of flexible leads.

Lead grid array integrated circuit

A multi-layered molded plastic package for encapsulating an integrated circuit is described. The package includes a carrier having a double-layered metal plate which are separated by an adhesive coated insulation tape. A second insulating tape layer is used to bond externally extending leads onto one of the metal plates. Power and ground connections from the terminal of the integrated circuit are made to each of the plates, respectively, as are the power and ground lead connections to the two plates. The power and ground planes remove the requirement for direct physical connection between the power and ground terminals of the integrated circuit and their respective leads.

Method of making a multilayer molded plastic IC package

The Electric double-layer capacitor (EDLC) or super-capacitors are becoming increasingly popular for their high specific power and for integrating that feature with batteries, which have a high specific energy. Due to the above reason, we have attempted to understand how to use super-capacitors and characterized them, so that both battery and super-capacitors can be used together, or for low power green energy applications, like various electronics gadgets, how to use only super-capacitors. In this paper, we described the known properties of a super-capacitor relative to a conventional lithium-ion battery. The structural design of the Super-capacitors and also various engineering-based applications, related to consumer electronics, transportation etc. are also described, as a review, in this paper. As we all know, that Super-capacitor's voltage would decay over time as we draw power from it, therefore maintaining the output voltage constant for any DC-DC converter without any battery is difficult. Thus, in this paper we have shown, how we have developed a DC-DC converter circuit, without any battery, which has both feed-back and feed forward control loop, in order to maintain constant output voltage. We also have developed a mathematical equation related to super-capacitor to show the requirement for having a feed-back loop can be eliminated while using super-capacitors which have very low Equivalent Series Resistance (ESR). We have also found that for some super-capacitors one cannot pump infinite current to charge a super-capacitor because the effective parallel resistance reduces as one try to pump large current and therefore charging these capacitors to a given desire voltage may not be possible. Therefore, in order to enhance the efficiency and to reduce the charging time of super-capacitor, we proposed and developed an algorithm having gamma function-based charging methodology for super-capacitor.

How and where to use super-capacitors effectively, an integration of review of past and new characterization works on super-capacitors

A thermally dissipative IC package which can accommodate large discrete capacitors. The package substrate incorporates a recessed region on one of its surfaces which is separate from the region in which the IC device is placed. Inside this recessed region is placed a discrete capacitor such that the entire capacitor resides below the surface of the substrate within the recessed region. Finally, a metal plate is attached to the surface of the substrate, unencumbered by the discrete capacitor.

High performance and high capacitance package with improved thermal dissipation

A high capacitance/low inductance capacitor module. The module comprises a plurality of conductive power planes that are separated from a plurality of conductive ground planes by layers of dielectric material. The power planes each have opposite extending tabs that are offset from similar tabs extending from the ground planes and which are coupled together by layers of conductive material. Likewise, the tabs of the ground planes are coupled together by additional layers of conductive material. The corresponding power and ground planes are also coupled together by vias located throughout the module. The conductive layers couple both sides of the corresponding conductive planes and provide contact pads for further assembly to a semiconductive die. The module is attached to the semiconductive die by a plurality of gold bumps which are formed on the top surface of the die.

Bidyut K. Bhattacharyya

Papers

Lead grid array integrated circuit

Method of making a multilayer molded plastic IC package

How and where to use super-capacitors effectively, an integration of review of past and new characterization works on super-capacitors

High performance and high capacitance package with improved thermal dissipation

De-coupling capacitor on the top of the silicon die by eutectic flip bonding