Provided is an apparatus for heat transfer that includes a device and a mechanism for transferring heat to or from the device, comprising using a heat transfer fluid, wherein the heat transfer fluid includes a hydrofluorocarbonate. Also provided is a method for transferring heat that includes providing a device and using the heat transfer fluid that includes a hydrofluorocarbonate to transfer heat to or from the device.

Heat transfer apparatus and methods including hydrofluorocarbonates

A cooling system is disclosed that includes a substrate having a metallic face, at least one microporous wick formation in thermal communication with the metallic face, and a liquid delivery head positioned in complementary opposition to the metallic face, the liquid delivery head having at least one nozzle for directing a liquid towards the metallic face.

System for Using Active and Passive Cooling for High Power Thermal Management

An electronic control module for a vehicle. The electronic control module includes a housing, a temperature sensor positioned in the housing, and a controller positioned in the housing and coupled to the temperature sensor. The controller includes a processor, a memory, and a plurality of switches. The controller performs a first function related to a comfort level of an occupant of the vehicle at a first level of functionality. The controller also detects a temperature in the housing, and modifies the first function when the detected temperature exceeds a temperature threshold. The modification of the first function reduces a quantity of heat generated by the controller.

Electronic control module heat limiting systems and methods

One or more embodiments of the invention include a heat sink device, system and method for removing heat from aircraft electronics including a chassis, an electronic unit, wherein the electronic unit is thermally coupled to the chassis, and a thermally conductive member, wherein the thermally conductive member includes a first interface for thermally contacting an electronic unit and a second interface for thermally contacting the chassis, the thermally conductive member being flexible in at least one direction between the first interface and the second interface to reduce load imparted on the electronic unit by the thermally conductive member in comparison to if the thermally conductive member were not flexible.

Flexible heat sink for aircraft electronic units

Embodiments include a heat sink cell comprising a first reservoir having a first volume of space and a first material stored in the first volume of space. The first material provides a first heat sink thermal operating range for the transfer of heat. The cell comprises a second reservoir and a second material stored in the second reservoir. A shape memory alloy (SMA) closes an opening of the second reservoir. The SMA is responsive to a temperature change of the first material or external sources to automatically open the opening so that the first material or the second material spontaneously pass through the opening to cause an endothermic reaction or an exothermic reaction between the first material and the second material to create a second heat sink thermal operating range different from the first heat sink thermal operating range. Embodiments also include a system and method of dual-mode passive thermal management.

Dual-mode passive thermal management system and method

A device for cooling electronic components (8) of a control unit in an unmanned flying vehicle comprises a container (12) containing a liquid cooling medium, means (10) adapted to sense the temperature of said electronic components during the flight of said vehicle and means (13) adapted to be controlled by said temperature sensing means to spray said liquid cooling medium directly upon said electronic components when the temperature thereof exceeds a predetermined level.

Bjoerk Hakan

Papers

A method for cooling electronic components in an unmanned flying vehicle and a device for carrying out the method