C
Chao Yang
Researcher at Nanjing University
Publications - 11
Citations - 1099
Chao Yang is an academic researcher from Nanjing University. The author has contributed to research in topics: Photonics & Optical communication. The author has an hindex of 7, co-authored 11 publications receiving 886 citations. Previous affiliations of Chao Yang include University of Arkansas.
Papers
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Journal ArticleDOI
Parity–time symmetry and variable optical isolation in active–passive-coupled microresonators
Long Chang,Xiaoshun Jiang,Shiyue Hua,Chao Yang,Jianming Wen,Liang Jiang,Guanyu Li,Guanzhong Wang,Min Xiao,Min Xiao +9 more
TL;DR: In this article, the authors demonstrate parity-time-symmetric optics on a chip at the 1,550-nm wavelength in two directly coupled high-Q silica-microtoroid resonators with balanced effective gain and loss.
Journal ArticleDOI
Realization of controllable photonic molecule based on three ultrahigh-Q microtoroid cavities
Chao Yang,Xiaoshun Jiang,Xiaoshun Jiang,Qian Hua,Shiyue Hua,Yuan Chen,Jiyang Ma,Min Xiao,Min Xiao,Min Xiao +9 more
TL;DR: In this paper, the authors demonstrate an experimental realization of a coupled triple-cavity photonic molecule (TCPM) composed of three independently selectable ultrahigh quality microtoroids.
Journal ArticleDOI
On-Chip Optical Nonreciprocity Using an Active Microcavity.
Xiaoshun Jiang,Chao Yang,Hongya Wu,Shiyue Hua,Long Chang,Yang Ding,Qian Hua,Min Xiao,Min Xiao +8 more
TL;DR: On-chip optical nonreciprocity with excellent isolation performance within telecommunication wavelengths using only one toroid microcavity is demonstrated, which makes this device become a promising critical building block indispensable for future integrated nanophotonic networks.
Journal Article
Realization of controllable photonic molecule based on three ultrahigh-Q microtoroid cavities
Journal ArticleDOI
High-Q silica microdisk optical resonators with large wedge angles on a silicon chip
TL;DR: In this paper, the authors demonstrate high optical quality factor silica microdisk resonators on a silicon chip with large wedge angles by reactive ion etching, achieving wedge angles of 59°, 63°, 70°, and 79°.