A built-in nut stepped hole PCB rapid machining method, comprising the following steps: S1: preparing a substrate for a cutting operation according to specifications, implementing electroplating according to a normal machining flow for a built-in nut stepped hole PCB, completing a tin electroplating pattern, and then implementing a drilling process to drill a built-in nut stepped hole; S2: built-in nut stepped hole design: measuring the upper diameter, inclined edge length, and height of a built-in nut, calculating the angle at the bottom of a drill bit, selecting a drill bit on the basis of the upper diameter of the nut and the angle of the bottom of the drill bit, and setting the depth of the built-in nut stepped hole on the basis of the height of the nut; S3: built-in nut stepped hole machining: selecting a drill having a depth-probe drilling function and implementing drilling on the basis of the design parameters of the built-in stepped hole designed in S2; S4: after completing drilling of the built-in stepped nut hole, implementing an electroplating etching process and continuing production to prepare the finished product. The present method has the advantages of high production efficiency, saving production costs, and improving machining precision.

Built-in nut stepped hole pcb rapid machining method

The invention discloses a circuit board manufacturing process which comprises the following steps: S1, drilling a blind hole on the circuit board, wherein the bottom of the blind hole is conical and the included angle between two buses of the conical axial cross section is an obtuse angle; S2, performing the first copper sinking treatment and the first electroplating treatment on the circuit boardso that the copper thickness in the blind hole reaches 5-8um; and S3, performing the second copper sinking treatment and the second full plate electroplating treatment on the circuit board so that the copper thickness in the blind hole reaches 15-20um The bottom of the blind hole of the circuit board is manufactured into a conical shape and two times of copper sinking and full plate electroplating are performed so that the copper layer in the blind hole is evenly distributed and the situation of no copper or thin copper thickness is avoided at the corner of the bottom of the blind hole

Circuit board manufacturing process

A PCB bell mouth manufacturing method comprises the following steps: 1, selecting a taper drill bit according to the bell mouth sizes; 2, calculating a drilling depth according to the client required bell mouth orifices bore diameter, and writing the result into a bell mouth boring program; 3, working in order according to a routine boring flow: a, mounting a joist plate; b, planting pins; c, loading a backing plate; d, loading a drilled plate; e, covering an aluminium sheet and pasting a gummed paper; f, starting a machine part mushroom head to press the aluminium sheet; g, covering a cold punching plate and using a gummed paper to firmly paste on same; 4, using an universal meter to confirm the aluminium sheet is connected with a drilling crew table top, and ensuring the unique coupling conduction portion between the aluminium sheet and the drilling crew table top is the mushroom head; 5, boring. The method calculates the drilling depth according to the tapper drilling bit angle and inputs the program, and the drilling crew can automatically make the bell mouth; the method is high in efficiency, and can make the precise bell mouths.

Chen Zhixin

Papers

PCB bell mouth manufacturing method