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Chonglun Fan

Researcher at Alcatel-Lucent

Publications -  34
Citations -  788

Chonglun Fan is an academic researcher from Alcatel-Lucent. The author has contributed to research in topics: Layer (electronics) & Coating. The author has an hindex of 15, co-authored 34 publications receiving 769 citations.

Papers
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Journal ArticleDOI

Study of Electrodeposited Nickel‐Molybdenum, Nickel‐Tungsten, Cobalt‐Molybdenum, and Cobalt‐Tungsten as Hydrogen Electrodes in Alkaline Water Electrolysis

TL;DR: In this article, the rate-determining step (rds) of the hydrogen evolution reaction (HER) was suggested based on the Tafel slope of polarization and the capacitance of electrode-solution interface determined by ac impedance measurement.
Journal ArticleDOI

Driving force for the formation of Sn whiskers: compressive stress-pathways for its generation and remedies for its elimination and minimization

TL;DR: In this paper, the authors discuss the pathways for compressive stress formation and various remedies for its elimination and minimization in Sn coatings, particularly, a novel approach for dealing with thermal mechanical stress due to CTE mismatch is discussed.
Patent

Multi-purpose finish for printed wiring boards and method of manufacture of such boards

TL;DR: A printed wiring board (PWB) as discussed by the authors is a substrate having a conductive trace located thereon and a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal.
Patent

Metallic surface enhancement

TL;DR: In this article, a method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate.
Patent

Silver plating in electronics manufacture

TL;DR: In this article, the authors present a method for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plated PWB which is more than 80 atomic % silver, tarnish resistant, and has good solderability.