A composition for the stripping of photoresist and the cleaning of residues from substrates, and for silicon oxide etch, comprising from about 0.01 percent by weight to about 10 percent by weight of one or more fluoride compounds, from about 10 percent by weight to about 95% by weight of a sulfoxide or sulfone solvent, and from about 20 percent by weight to about 50 percent by weight water. The composition may contain corrosion inhibitors, chelating agents, co-solvents, basic amine compounds, surfactants, acids and bases.

Compositions for cleaning organic and plasma etched residues for semiconductor devices

The present invention presents methods for, inter alia, cleaning and etching semiconductor wafers with a solution containing ammonium fluoride and control of the process used for preparing such a solution at its point of use.

Methods for treating semiconductor wafers

A low reflectance glass surface is disclosed which includes a particular combination of surface structures which produce a low reflectance yet high clarity glass. The surface structure includes a plurality of islands distributed at a density of about 60 to 10,000 islands per square millimeter. The glass surface also includes a skeletalized silica structure of 200 to 600 angstroms in diameter, uniformly distributed over the surface. By combining the various surface structures on one piece of glass, unique properties of low reflectance yet high clarity are provided, which is particularly suitable for use in picture frames where any distortion would distract from viewing a picture contained therein and also in computer or t.v. screens where distortion or glare could produce operator fatigue or stress. The glass structure is achieved by a process which is readily adaptable to existing production lines without requiring major modifications. Consequently, the low glare high clarity glass can be produced economically, allowing use in applications not previously adaptable to the highly expensive anti-reflection glass previously available.

Anti-reflective glass surface

A low reflectance glass surface with improved cleanability is disclosed which includes a particular combination of surface structures which produce a low reflectance yet high clarity glass. The surface structure includes a plurality of islands distributed at a density of about 60 to about 10,000 islands per square millimeter. The glass surface also includes a skeletalized silica structure of about 100 to about 400 angstroms in diameter uniformly distributed over the surface. By combining the various surface structures on one piece of glass, unique properties of low reflectance yet high clarity are provided, which is particularly suitable for use in picture frames where any distortion would distract from viewing a picture contained therein and also in computer or t.v. screens where distortion or glare could produce operator fatigue or stress. The glass structure is achieved by a process which is readily adaptable to existing production lines without requiring major modifications. Consequently, the low glare high clarity glass can be produced economically, allowing use in applications not previously adaptable to the highly expensive anti-reflection glass previously available.

Anti-reflective glass surface with improved cleanability

The invention is a metal treating process which uses a chrome-free deoxidizing bath. The process is useful for cleaning and deoxidizing aluminum substrates followed by conversion coating of the cleaned and deoxidized substrates.

Treatment of aluminum with non-chrome cleaner/deoxidizer system followed by conversion coating

Process for improving the stability of aqueous solutions containing hydrogen peroxide, metal ions and hydrofluoric acid which can be partially in the form of salts, comprising adding to the said solution at least one hydroxide selected from alkali metal hydroxides, ammonium hydroxide, or mixtures thereof in an amount which is insufficient to neutralize all the acidity present. The resultant novel stabilized solutions according to the invention are used in the surface treatment of metals especially of stainless steels.

Stabilization of aqueous solutions containing hydrogen peroxide, hydrofluoric acid and metal ions

Procede pour ameliorer la stabilite de solutions aqueuses contenant du peroxyde d'hydrogene, des ions metalliques et de l'acide fluorhydrique pouvant etre partiellement sous forme de sels, consistant a ajouter a ladite solution au moins un hydroxyde choisi parmi les hydroxydes de metaux alcalins et l'hydroxyde d'ammonium, en quantite insuffisante pour neutraliser la totalite de l'acidite presente. Process for improving the stability of aqueous solutions containing hydrogen peroxide, metal ions and hydrofluoric acid which may be partially in the form of salts, consisting in adding to said solution at least one hydroxide selected from alkali metal hydroxides and ammonium hydroxide, in sufficient quantity to neutralize all of the acidity present. Les solutions stabilisees selon l'invention trouvent une application dans le traitement de surface des metaux, en particulier des aciers inoxydables. The stabilized solutions according to the invention find application in the surface treatment of metals, in particular stainless steels.

Stabilization of aqueous solutions containing hydrogen peroxide, hydrogen fluoride and metallic ions

Stabilisierung von waessrigen loesungen,die wasserstoffperoxid, fluorwasserstoff und metallionen enthalten.

Procede pour ameliorer la stabilite de solutions aqueuses contenant du peroxyde d'hydrogene, des ions metalliques et de l'acide fluorhydrique pouvant etre partiellement sous forme de sels, consistant a ajouter a ladite solution au moins un hydroxyde choisi parmi les hydroxydes de metaux alcalins et l'hydroxyde d'ammonium, en quantite insuffisante pour neutraliser la totalite de l'acidite presente. Les solutions stabilisees selon l'invention trouvent une application dans le traitement de surface des metaux, en particulier des aciers inoxydables.

Christian Pralus

Papers

Stabilization of aqueous solutions containing hydrogen peroxide, hydrofluoric acid and metal ions

Stabilization of aqueous solutions containing hydrogen peroxide, hydrogen fluoride and metallic ions

Stabilisierung von waessrigen loesungen,die wasserstoffperoxid, fluorwasserstoff und metallionen enthalten.

Stabilisation de solutions aqueuses contenant du peroxyde d'hydrogene, de l'acide fluorhydrique et des ions metalliques