Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.

Printed circuit board and method of manufacturing the same

Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a first insulating layer, a second insulating layer on the first insulating layer, and at least one via formed through the first and second insulating layers and having a layer structure. The via includes a first via layer formed through the first insulating layer, a second via layer formed on the first via layer while passing through the second insulating layer, and an adhesive layer between the first and second via layers. The first via layer has a section different from a section of the second via layer.

The printed circuit board and the method for manufacturing the same

Ductile electroless Ni–P coating onto flexible printed circuit board

The present invention concerns an electroless nickel plating bath suitable for application in plating on plastic processes. The plating bath is free of hazardous substances such as lead ions and ammonia and allows deposition of nickel phosphorous alloys on plastic substrates at plating temperatures not higher than 55 °C. Furthermore, the deposition of copper from an immersion type copper plating bath onto the nickel phosphorous coatings require no activation step which results in less process steps and less waste water production.

Electroless nickel plating bath

A method of providing solar cell electrode by electroless plating and an activator used therein are disclosed. The method of the present invention can be performed without silver paste, and comprises steps: (A) providing a silicon substrate; (B) contacting the silicon substrate with an activator, wherein the activator comprises: a noble metal or a noble metal compound, a thickening agent, and water; (C) washing the silicon substrate by a cleaning agent; (D) dipping the silicon substrate in an electroless nickel plating solution to perform electroless plating. The method of providing solar cell electrode by electroless plating of the present invention has high selectivity between silicon nitride and silicon, large working window, and is steady, easily to be controlled, therefore is suitable for being used in the fabrication of the electrodes of the solar cell substrate.

Method of providing solar cell electrode by electroless plating and an activator used therein

The present invention relates to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof, and more particularly, to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units of the flexible printed circuit board by forming a nickel plating layer having a vertical growth structure with the electroless nickel plating solution composition including a water-soluble nickel compound, a reducing agent, a complexing agent and a vertical growth inducer.

Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof

PURPOSE: An electroless nickel plating solution composition, a flexible printed circuit board and a method of manufacture thereof are provided to replace a double plating process of nickel and direct gold coating with a single plating process. CONSTITUTION: An electroless nickel plating solution composition comprises water-soluble Ni-chemical compound, reducing agent, complexion agent, vertical growth derivative, vertical growth aiding agent. The vertical growth derivative comprises the compound having bismuth ion. A nickel plated layer(150) is formed using electroless nickel plating solution composition. The vertical growth derivative is composed of 0.001~1 weight% based on the composition range of electroless nickel plating solution composition. The vertical growth aiding agent is ether thallium ion, iron ion or copper ion.

Electroless nickel solution composition, flexible printed circuit board and manufacturing method of the same

Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.

Chul Min Lee

Papers

Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof

Electroless nickel solution composition, flexible printed circuit board and manufacturing method of the same

Substrate structure and method of manufacturing the same

Printed circuit board where the test coupon of the micro-via is had and the manufacturing method