Showing papers by "Claudia Gemme published in 2001"
01 Jun 2001-Nuclear Instruments & Methods in Physics Research Section A-accelerators Spectrometers Detectors and Associated Equipment
TL;DR: The bump-bonding technology is used to join the front-end read-out chips to the silicon substrate of the ATLAS pixel detector as discussed by the authors, and the current status of the technology used by Alenia Marconi Systems and the defect rate of the Indium bumps.
Abstract: The bump-bonding technology is used to join the front-end read-out chips to the silicon substrate of the ATLAS pixel detector. We review the current status of the technology used by Alenia Marconi Systems and we report on the electrical and mechanical properties and the defect rate of the Indium bumps. # 2001 Elsevier Science B.V. All rights reserved.
30 citations