Semiconductor dies (101/104/106) are stacked offset from one another so that terminals (122/124/126) located along two edges of each die are exposed. The two edges of the dies having terminals may be oriented in the same direction. Electrical connections (130/132/134) may connect terminals on one die with terminals on another die and the stack may be disposed on a wiring substrate (112) to which the terminals of the dies may be electrically connected.

Stacked die module

A memory module can include a plurality of dynamic memory devices that each can include a dynamic memory cell array with respective regions therein, where the plurality of dynamic memory devices can be configured to operate the respective regions responsive to a command. A DRAM management unit can be on the module and coupled to the plurality of dynamic memory devices, and can include a memory device operational parameter storage circuit that is configured to store memory device operational parameters for the respective regions to affect operation of the respective regions responsive to the command.

Memory circuits, systems, and modules for performing DRAM refresh operations and methods of operating the same

Chip scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The chip scale package includes a core member of a metal or alloy having a recess for at least partially receiving a die therein and includes at least one flange member partially folded over another portion of the core member. Conductive traces extend from one side of the package over the at least one flange member to an opposing side of the package. Systems including the chip scale packages and assemblies are also disclosed.

Metal core foldover package structures, systems including same and methods of fabrication

A semiconductor package has a first substrate having a plurality of electrically conductive patterns formed thereon. A first semiconductor die is coupled to the plurality of conductive patterns. A second semiconductor die is coupled to the first semiconductor die by a die attach material. A third semiconductor die is coupled to the second semiconductor die by a die attach material. A second substrate having a plurality of electrically conductive patterns formed thereon is coupled to the third semiconductor die. A plurality of contacts is coupled to a bottom surface of the first substrate. A connector jack is coupled to the second substrate. A plurality of leads is coupled to the second semiconductor die by conductive wires.

Semiconductor package having a plurality of input/output members

An integrated circuit package stacking system includes: forming a flexible substrate by: providing an insulating material, forming a stacking pad on the insulating material, forming a coupling pad on the insulating material, and forming a trace between the stacking pad and the coupling pad; providing a package substrate; coupling an integrated circuit to the package substrate; and applying a conductive adhesive on the package substrate for positioning the flexible substrate over the integrated circuit and coupling the flexible substrate on the conductive adhesive.

Integrated circuit package stacking system

An IC die and a flexible circuit structure are integrated into a lower stack element that can be stacked with either further integrated lower stack element iterations or with pre-packaged ICs in any of a variety of package types The present invention may be employed to stack similar or dissimilar integrated circuits and may be used to create modularized systems In a preferred embodiment, a die is positioned above the surface of portions of a pair of flex circuits Connection is made between the die and the flex circuitry A protective layer such as a molded plastic, for example, is formed to protect the flex-connected die and its connection to the flex Connective elements are placed along the flex circuitry to create an array of module contacts along the second side of the flex circuitry The flex circuitry is positioned above the body-protected die to create an integrated lower stack element The integrated lower stack element may be stacked either with iterations of the integrated lower stack element or with a pre-packaged IC to create a multi-element stacked circuit module

Curtis Hart

Papers

Modularized die stacking system and method