Phased Arrays in Radar and Communication Systems. Pattern Characteristics and Synthesis of Linear and Planar Arrays. Patterns of Nonplanar Arrays. Elements, Transmission Lines, and Feed Architectures for Phased Arrays. Summary of Element Pattern and Mutual Impedance Effects. Array Error Effects. Special Array Feeds for Limited Field of View and Wideband Arrays.

Phased Array Antenna Handbook

Preface. Microelectromechanical Systems (MEMS) and Radio Frequency MEMS. MEMS Materials and Fabrication Techniques. RF MEMS Switches and Micro Relays. MEMS Inductors and Capacitors. Micromachined RF Filters. Micromachined Phase Shifters. Micromachined Transmission Lines and Components. Micromachined Antennae. Integration and Packaging for RF MEMS Devices. Index.

RF MEMS and their applications

The design is presented of aperture-coupled microstrip line-fed patch antennas (ACMPAs) and 4times4 planar arrays on Ferro A6-S low-temperature cofired ceramic (LTCC) substrate operating in the 60-GHz frequency band. In addition to the traditional ACMPA design, air cavities processed inside the LTCC substrate are used to improve the bandwidth and gain of the antennas. The arrays are excited through the microstrip-line feed networks using quarter-wave matched T-junctions and using Wilkinson power dividers. The results show that ACMPAs and arrays can be fabricated with a standard LTCC process even for the millimeter-wave region. Good agreement is achieved between simulations and measurements. The measured S-parameters indicate impedance bandwidths of 9.5% and 5.8% for the array elements with and without an embedded cavity. The measured maximum gains for the 16-element patch arrays (with and without cavity) are 18.2 and 15.7 dBi, respectively.

60-GHz Patch Antennas and Arrays on LTCC With Embedded-Cavity Substrates

This paper presents the use of selective lateral etching based on micromachining techniques to enhance the performance of rectangular microstrip patch antennas printed on high-index wafers such as silicon, GaAs, and InP. Micromachined patch antennas on Si substrates have shown superior performance over conventional designs where the bandwidth and the efficiency have increased by as much as 64% and 28%, respectively. In this work, the silicon material is removed laterally underneath the patch antenna to produce a cavity that consists of a mixture of air and substrate with equal or unequal thicknesses. Characterization of the micromachined patch antenna is presented herein and includes a discussion on the bandwidth improvements, radiation patterns, and efficiency of the patch. In addition, antenna placement on the reduced index cavity with respect to the high-index substrate is described to achieve efficiency improvements over conventional patch antennas.

Micromachined patch antennas

Introduction Review of Some Background Materials General Formulation of the Cavity Model Characteristics of the Rectangular Patch Characteristics of the Circular Patch The Annular-Ring and the Equilaterial Triangular Patch Introduction to Full Wave Analysis of Microstrip Antennas Some Methods of Tuning the Resonant Frequencies of Patch Antennas Broadbanding Techniques Size Reduction Techniques Dual and Multi-Band Designs Dual Polarized Patch Antenna Designs Circular Polarization Microstrip Arrays

Microstrip Patch Antennas

Microstrip antennas have been one of the most innovative topics in antenna theory and design in recent years, and are increasingly finding application in a wide range of modern microwave systems. This paper begins with a brief overview of the basic characteristics of microstrip antennas, and then concentrates on the most significant developments in microstrip antenna technology that have been made in the last several years. Emphasis is on new antenna configurations for improved electrical performance and manufacturability and on advances in the analytical modeling of microstrip antennas and arrays. >

D.M. Pozar

Papers

Microstrip antennas