A multilayer rigid-flex circuit board having two or more conductive layers, with at least one rigid circuit board (70,80) electrically connected to at least one flexible jumper connector (75) or intercircuit connector circuit board, is disclosed. A conductive layer (71,82) of each of the rigid circuit boards (70,80) is connected electrically and mechanically to a conductive layer (76) of the flexible jumper connector (75) by an interconnecting adhesive layer (85,90). The interconnecting adhesive layer (85,90) comprises a conductive adhesive material having a plurality of deformable, electrically conductive particles (87,92) dispersed substantially throughout a non-conductive adhesive (86,91). The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding the mechanical strain of the interconnection and the thermal cycling and typical circuit board fabrication, finishing and assembly processes. Such a rigid-flex circuit is typically used in an environment where space is limited. During installation, the flexible connector (75) is generally bent to adapt to the dimensional constraint of the surroundings.

Rigid-flex board with anisotropic interconnect and method of manufacture

Flexible multilayer printed circuit boards are disclosed which utilize adhesiveless laminates interconnected in a generally superposed relationship by a conductive adhesive. In one embodiment, the adhesiveless laminates have relatively thin conductive layers and metallized through holes which exhibit high delamination resistance. The metallized through holes preferably have a thickness of at most about 25 microns, yet they are capable of withstanding multilayer assembly processes. High flexibility, reliability, packaging density, and environmental resistance are consequently available in a thin multilayer construction. In a further embodiment, adhesiveless dielectric layers are interposed between adhesiveless laminates to electrically insulate portions thereof. The adhesiveless dielectric layers may define relatively small apertures therein, thus providing greater packaging density for a multilayer printed circuit board.

Flexible multilayer printed circuit boards and methods of manufacture

A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Method for electrically and mechanically connecting at least two conductive layers

A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multi-layered glass-ceramic superstructure with a multi-layered distribution of conductors on a preformed multi-layered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to expose conductor patterns at the top surface of the resultant glass-ceramic package.

Multi-layered glass-ceramic substrate for mounting of semiconductor device

Multilayer electronic circuit having a conductive adhesive

An improved microcircuit package is provided for integrated circuit chips, or the like, and which greatly simplifies the manner in which electrical connections may be made between the contacts on the chip and the terminal electrodes and other connections of the microcircuit. The package of the invention comprises a substrate of glass ceramic, polymide, or the like, having adhesive electric conductors formed on its surface, which conductors make connection between the contacts on the integrated circuit chip and the terminal electrodes, merely by pressing the chip over the adhesive electric conductors, the conductors serving additionally to hold and position the chip in the flat pack.

D May

Papers

Package for integrated circuit chip