An object is to provide a method for manufacturing a semiconductor device, in which the number of photolithography steps can be reduced, the manufacturing process can be simplified, and manufacturing can be performed with high yield at low cost A method for manufacturing a semiconductor device includes the following steps: forming a semiconductor film; irradiating a laser beam by passing the laser beam through a photomask including a shield for shielding the laser beam; subliming a region which has been irradiated with the laser beam through a region in which the shield is not formed in the photomask in the semiconductor film; forming an island-shaped semiconductor film in such a way that a region which is not irradiated with the laser beam is not sublimed because it is a region in which the shield is formed in the photomask; forming a first electrode which is one of a source electrode and a drain electrode and a second electrode which is the other one of the source electrode and the drain electrode; forming a gate insulating film; and forming a gate electrode over the gate insulating film

Method for Manufacturing Semiconductor Device

Mapping apparatus includes a transmitter, which emits a beam comprising pulses of light, and a scanner, which is configured to scan the beam, within a predefined scan range, over a scene. A receiver receives the light reflected from the scene and to generate an output indicative of a time of flight of the pulses to and from points in the scene. A processor is coupled to control the scanner so as to cause the beam to scan over a selected window within the scan range and to process the output of the receiver so as to generate a 3D map of a part of the scene that is within the selected window.

Scanning depth engine

A method of scanning a light beam is disclosed. The method comprises scanning the light beam along a first axis and scanning the light beam along a second axis, such that a functional dependence of the scanning along the first axis is substantially a step-wave, and a functional dependence of the scanning along the second axis is other than a step-wave.

Method and device for scanning light

PROBLEM TO BE SOLVED: To provide a dicing method which is less in breaking or cracking on a semiconductor wafer, reduces the futility of a usable area on a semiconductor wafer, and enables the achievement of a high production throughput.SOLUTION: Methods of dicing semiconductor wafers, each having a plurality of integrated circuits mounted thereon are disclosed. The method comprises: a step 302 for forming, on a semiconductor wafer, a mask for covering and protecting the integrated circuits; a step 304 for patterning the mask by femtosecond laser scribing to form a patterned mask with gaps and to expose regions between the integrated circuits on the semiconductor wafer; and a step 306 for etching the semiconductor wafer through the gaps of the patterned mask to cut the wafer into the individual integrated circuits.SELECTED DRAWING: Figure 3

Wafer dicing using femtosecond-based laser and plasma etch

A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.

Compact camera module

A method for sawing a wafer having a large number of semiconductor devices, e.g., image sensor devices is provided. In one embodiment, a protective layer covers micro-lenses of the image sensor devices to protect the lenses from being damaged or polluted by, for example, silicon dust during wafer sawing. The silicon dust remaining in a gap between the devices is removed together with an adhesive tape on the backside surface of the wafer. Accordingly, the silicon dust cannot affect the micro-lenses during the wafer sawing process or subsequent die-attach, so that image defects caused by the silicon dust can be reduced and the yield of the image sensor devices is increased.

Dae Young Kim

Papers

Method for sawing wafer