A method and apparatus for depositing a film on a substrate by plasma-enhanced chemical vapor deposition at temperatures substantially lower than conventional thermal CVD temperatures comprises placing a substrate within a reaction chamber and exciting a first gas upstream of the substrate to generate activated radicals of the first gas. The substrate is rotated within the deposition chamber to create a pumping action which draws the gas mixture of first gas radicals to the substrate surface. A second gas is supplied proximate the substrate to mix with the activated radicals of the first gas and the mixture produces a surface reaction at the substrate to deposit a film. The pumping action draws the gas mixture down to the substrate surface in a laminar flow to reduce recirculation and radical recombination such that a sufficient amount of radicals are available at the substrate surface to take part in the surface reaction. Another method utilizes a gas-dispersing showerhead that is biased with RF energy to form an electrode which generates activated radicals and ions in a concentrated plasma close to the substrate surface. The activated plasma gas radicals and ions utilized in the invention contribute energy to the surface reaction such that the film may be deposited at a substantially lower deposition temperature that is necessary for traditional thermal CVD techniques. Furthermore, the activation of these species reduces the temperature needed to complete the surface reaction. The method is particularly useful in depositing titanium-containing films at low temperatures.

Method for producing titanium thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor

Low temperature deposition of CVD and PECVD films utilizes a gas-dispersing showerhead (36) position within one inch of a rotating substrate. The showerhead is positioned a suitable distance below a gas-dispensing ring (50, 52) such a steady state flow of gas develops between the ring and showerhead. A cylindrical structure extends between the gas-dispersing ring and a showerhead to contain the gas over the showerhead yielding a small boundary layer over the substrate. The showerhead is biased with RF energy such that it acts as an electrode to incite a plasma proximate with the substrate for PECVD. The cylinder (60) is isolated from the showerhead such as by a quartz insulator ring (62) to prevent ignition of a plasma within the cylinder, or alternatively, the cylinder is fabricated of quartz material. The RF showerhead utilizes small gas-dispersing holes (54) to further prevent ignition of a plasma within the cylinder.

Method and apparatus for low temperature deposition of cvd and pecvd films

A passive method and packaging system for thermally controlling the temperature of electronic equipment within a housing are disclosed. The packaging system provides for two cooling steps, each of which uses a different passive cooling technology. Cooling by changing the phase of Phase Change Material, assists in controlling internal ambient temperatures by limiting the effects of short term localized thermal phenomena which would otherwise further increase internal temperatures. Cooling is also provided for by switching on a second passive cooling means, preferably a heat pipe, as the internal temperature of the housing increases above a predetermined temperature and to switch it off as the internal temperature drops below the predetermined temperature. Turning the second passive cooling means on and off provides respectively, a low or high thermal resistance path between the interior and exterior of the housing. The second passive cooling means allows for cooling of the housing above the predetermined temperature as well as heating of the housing below the predetermined temperature by preserving heat generated by the equipment. The two cooling steps in combination, co-operate to limit both maximum and minimum temperatures within the housing and of components. The combination of cooling steps also allows control over the temperature delta between the maximum and minimum temperatures during internal temperature swings.

Packaging system for thermally controlling the temperature of electronic equipment

A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.

Method of making solder balls by contained paste deposition

A ball grid array (BGA) integrated circuit package which has a plurality of elliptically shaped solder pads located on a bottom surface of a package substrate. The bottom surface also has a solder mask which contains a number of holes that expose the solder pads. The holes allow solder balls to be attached to the solder pads. The solder balls can be reflowed to attach the package to a printed circuit board. The elliptical shaped solder pads have a width that is smaller than the length of the pads. The narrow pad portions provide additional routing space for the bottom surface of the package. The solder mask hole diameters are less than the lengths of the solder pads so that portions of the pads are anchored by the maskant material. The anchored portions increase the peel strength of the pads.

Ball grid array integrated circuit package that has vias located within the solder pads of a package

A heat sinking assembly for dissipating thermal energy from heat generating electrical components wherein the heat sinking assembly includes a component support member and a housing which surrounds and clamps the electrical components to the heat sink wherein the components are not heat sunk until the first half of the housing assembly is attached to the circuit board or to the second half of the housing assembly The clamping force for the electrical components may also be varied for optimum heat transfer

Heat sinking assembly for electrical components

A terminal pattern is provided for an integrated circuit device, such as a ball grid array package or an integrated circuit flip chip. The terminal pattern is composed of a number of terminals arranged in concentric arrays, each array having a substantially circular shape and being composed of a number of terminals. The terminal pattern is composed of at least two arrays, and more typically three or more arrays. When the integrated circuit device is mounted to its intended substrate, the individual terminals of the terminal pattern each register with and are soldered to a corresponding conductor of a conductor pattern formed on the substrate. A significant advantage is that, due to the terminals of the terminal pattern being arranged in concentric arrays, a smaller maximum width for the terminal pattern is achieved than possible with a conventional rectangular terminal pattern having the same number of terminals. As such, the terminal pattern and the resulting solder joints between the terminal pattern and its corresponding conductor pattern exhibit improved fatigue life as compared to the conventional rectangular terminal pattern.

Reduced stress terminal pattern for integrated circuit devices and packages

A flexible capacitor is provided which is suitable for use in conjunction with a magnetic core for forming a CLC or pi filter, such as the type used for electrical connectors in the engine control hardware for an automobile. The flexible capacitor is generally composed of a flexible substrate having a surface on which interleaved conductor layers are supported. The interleaved conductor layers include at least two conductor layers, a first of which is composed of a plurality of islands of electrically conductive material which are electrically isolated from each other, while a second layer is composed of an electrically conductive material. A dielectric layer is disposed intermediate each adjacent pair of conductor layers so as to form a capacitive structure. The first conductor layer serves as the signal capacitor plate, while the second conductor layer serves as the ground capacitor plate. The islands of the first conductive layer are preferably arranged in at least two arrays which are spaced apart on the flexible substrate. The flexible capacitor overlays, and preferably wraps around, at least a portion of a magnetic core member, such that the core member forms an inductive element between capacitive elements of the pi filter.

David A. King

Papers

Heat sinking assembly for electrical components

Reduced stress terminal pattern for integrated circuit devices and packages

Flexible capacitor filter