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Showing papers by "David C. Miller published in 2003"


Patent
20 Nov 2003
TL;DR: A number of methods and systems for overcoming stiction are provided in this paper, including electro-mechanical systems capable of exerting a variety of forces upon areas prone to stiction.
Abstract: A number of methods and systems for overcoming stiction are provided. The systems include electro-mechanical systems capable of exerting a variety of forces upon areas prone to stiction. The systems can be MEMS arrays or other types of devices where stiction related forces occur. The methods include a variety of ways of causing movement in areas prone to stiction forces. Such movement can be vibrational in nature and is sufficient to overcome stiction, allowing a trapped element to be moveed to a desired location.

79 citations


Patent
29 Sep 2003
TL;DR: In this paper, a method and apparatuses are provided for protecting an interconnect line (216) in a microelectromechanical system, which is disposed over a substrate for conducting electrical signals such as from a bonding pad (204) to a mechanical component to effect movement as desired of the mechanical component.
Abstract: Method and apparatuses are provided for protecting an interconnect line (216) in a microelectromechanical system. The interconnect line (216) is disposed over a substrate for conducting electrical signals, such as from a bonding pad (204) to a mechanical component to effect movement as desired of the mechanical component. A first protective covering (208) is disposed over a first portion of the interconnect line and a second protective covering (212) is disposed over a second portion of the interconnect line. The first protective covering (208) is provided in electrical communication with the substrate and the second protective covering is electrically isolated from the substrate.

3 citations


Patent
09 Sep 2003
TL;DR: In this paper, a method for preventing dopant leaching from a doped structural film during fabrication of a microelectromechanical system is described, using a combination of deposition, patterning, and etching techniques.
Abstract: A method is provided for preventing dopant leaching from a doped structural film during fabrication of a microelectromechanical system. A microstructure that includes the doped structural film, sacrificial material, and metallic material is produced with a combination of deposition, patterning, and etching techniques. The sacrificial material is dissolved with a release solution that has a substance destructive to the sacrificial material. This substance also acts as an electrolyte, forming a galvanic cell with the doped structural film and metallic material acting as electrodes. The effects of the galvanic cell are suppressed by including a nonionic detergent mixed in the release solution.

3 citations


Proceedings ArticleDOI
TL;DR: The first commercially available, MEMS-based wavelength selective switch, CrossWave as discussed by the authors, combines the functionality of signal demultiplexing, switching and re-multiplexing in a single all-optical operation using a dispersive element and 1-D MEMS.
Abstract: We introduce the Network Photonics' Crosswave as the first commercially-available, MEMS-based wavelength selective switch. The CrossWave combines the functionality of signal demultiplexing, switching and re-multiplexing in a single all-optical operation using a dispersive element and 1-D MEMS. 1-D MEMS, where micronurrors are configured in a single array with a single mirror per wavelength, are fabricated in a standard surface micromachining process. In this paper we present three generations of micromirror designs. With proper design optimization and process improvements we have demonstrated exceptional mirror flatness (<16.2m -1 curvature), surface error (<λ/200), and surface roughness (<7A RMS and <4nm peak-to-valley). These values were shown to be comparable to those obtained from bulk micromachining. This excellent optical performance in combination with a CMOS-like approach of the SUMMiT IV process (currently available at a commercial foundry) have demonstrated the emerging leadership of surface micromachining for upcoming optical telecom-munication applications.

1 citations