A method and apparatus for editing heterogeneous media objects in a digital imaging device having a display screen, where each one of the media objects has one or more media types associated therewith, such as a still image, a sequential image, video, audio, and text. The method aspect of the present invention begins by displaying a representation of each one of the media objects on the display screen to allow a user to randomly select a particular media object to edit. In response to a user pressing a key to edit a selected media object, one or more specialized edit screens is invoked for editing the media types associated with the selected media object. If the media object includes a still or a sequential image, then an image editing screen is invoked. If the media object includes a video clip, then a video editing screen is invoked. If the media object includes an audio clip, then an audio editing screen is invoked. And if the media object includes a text clip, then a text editing screen is invoked.

Method and apparatus for editing heterogeneous media objects in a digital imaging device

A method and system (110) for correcting the aspect ratio of an image captured by a digital camera (114) is disclosed. In one aspect, the method and system (110) include determining if the image requires cropping, decompressing the image, and cropping the image if the image requires cropping. The image is then provided to a display. In another aspect, the method and system (110) include cropping an image to a predetermined shape and providing the data to a display buffer.

Method and apparatus for correcting aspect ratio in a camera graphical user interface

A semiconductor pressure sensor compatible with fluid and gaseous media applications is described The semiconductor pressure sensor includes a sensor capsule having a semiconductor die and a silicon cap that is bonded to the semiconductor die The semiconductor die includes a diaphragm that incorporates piezoresistive sensors thereon, and a stress isolation mechanism for isolating the diaphragm from packaging and mounting stresses The silicon cap includes a cavity for allowing the diaphragm to deflect The semiconductor pressure sensor further includes a pressure port that is hermetically attached to the semiconductor die The sensor capsule and pressure port may be incorporated into a plastic housing In one embodiment, the silicon cap is bonded to the semiconductor die to form an integral pressure reference In an alternative embodiment, a second pressure port is provided for allowing gage or differential pressure measurements A technique for incorporating the piezoresistive sensors is also described An ASIC may be optionally attached to the silicon cap, and/or active electronic circuitry may be fabricated on the semiconductor die or silicon cap Additional coatings may be optionally applied to the pressure port and semiconductor die for enhancing chemical resistance

Compensated semiconductor pressure sensor

A hermetic media interface for a sensor package is disclosed. Preferably, the hermetic media interface is incorporated into a pressure sensor package for interfacing directly to fluid and/or gaseous media. In one embodiment, the pressure sensor package includes a semiconductor die and a pressure port that are housed in a pre-molded plastic package. A eutectic solder is coupled between the semiconductor die and the pressure port to solder the same to the semiconductor die. The semiconductor die may be metallized to enhance solderability. In an alternative embodiment, the pressure port is made from one or more plastic materials and the pressure port is attached to the semiconductor die with an adhesive. An integral stress-isolation region may optionally be incorporated on the semiconductor die.

Hermetic packaging for semiconductor pressure sensors

The present invention relates generally to a new interface and a method for making the same, and more particularly, to an optical fiber interface and a method for making the same. On a substrate having semiconductors, a receiver/transmitter connection is provided to interface with an optical fiber. Integral means for the fiber alignment, support and transit through a sealed environment is also provided. The substrate having the receiver/transmitter secured to it with the optical fiber end, is then enclosed in a housing.

Apparatus and a method for an optical fiber interface

An optoelectronic tilt detector (10 and 35) having a cavity (17) is provided. The cavity (17) has a sidewall (18), a tapered floor (19), and a tapered ceiling (20). The tapered floor (19) and the tapered ceiling (20) have a first passage (23) and a second passage (24) through which radiation such as light may pass. Housed within the cavity (17) is an opaque sphere (14). The opaque sphere (14) moves within the container (17) in accordance with the tilt of the cavity (17) to uncover either the first passage (23) or the second passage (24). The opaque sphere (14) may operate in conjunction with a light emitting device (12) and a light detector (13) to allow radiation to travel from the light emitting device (12) to the light detector (13) when the cavity (17) is tilted, thereby providing a measure of tilt.

Optoelectronic tilt detector having tapered floors extending in same direction

The present invention provides a method of coupling an electrical signal to an optical fiber (14). The method includes encapsulating an electrical connector (21), an optical semiconductor device (18,36), and a fiber optic cable (14) all in one body (23,38,41,42). The semiconductor device (18,36) is electrically coupled to the electrical connector (21), and is also aligned to the fiber optic cable (14). The components are encapsulated in one single body (23,38,41,42). The single body (23,38,41,42) permanently maintains the alignment. The electrical connector (21) portion of the body (23,38,41,42) provides an easy means to couple the fiber optical cable (14) to electrical signals.

Method of coupling an electrical signal to an optical fiber

A pressure sensor package (10) has a sensor body (12) for containing a pressure sensor. An elongated stem (14) has a first end connected to the sensor body (12), and a connector (24, 26) is disposed on a second end of the stem (14) for fixedly mounting the stem (14) to a mounting base (40), which is connected to, for example, a fuel tank (52). An annular sealing surface (28) is disposed on the first end of the stem (14) for pressing against a compressible seal (44) when the stem (14) is mounted to the mounting base (40), and an orifice (18) is disposed at the second end of the stem (14). The orifice 18 is connected to the pressure sensor by a passage (20, 22) through the stem body. The connector (24, 26) is spaced a sufficient distance from the sensor body (12) to substantially reduce error-inducing stresses on the pressure sensor.

Pressure sensor package for reducing stress-induced measurement error

An improved vehicle height sensor and automotive leveling system are described using, in a preferred embodiment, two optical emitter-receiver pairs mounted in the sidewall or dust cover of a standard automotive air shock. The emitter-receiver pairs are arranged to operate by reflecting light from the central shaft of the shock absorber. Each emitter-receiver pair provides a light path that lies in a plane substantially perpendicular to the extension direction of the shock. The two emitter receiver pairs are spaced apart along the extension direction of the shock. Movement of the internal piston of the shock successively interrupts (by absorption) the light paths of the emitter-receiver pairs so as to provide a positive indication of the location of the movable piston and hence the height of the shock and the height of vehicle body above the road. The emitter-receiver pairs are mounted in a common assembly and seal to the shock dust cover through a single hole. They are convenient to manufacture in a single module which includes the control logic needed to add to remove fluid from the shock to maintain it in reference position independent of the vehicle load. This makes possible a particularly compact unit.

Apparatus employing reflective optical means

Braided plastic sleeving useful in electronic applications is readily cut by means of a hot wire which is advanced through the sleeving when in flattened form at a controlled rate. It is important that the sleeving be under tension at the location where the cut is to be made. The size of the heated wire and the rate of advance of the heated wire through the flattened braided sleeving relative to the size of the braided sleeving is important to obtaining cutting and sealing of the ends of the braided sleeving without welding the ends shut. Means and method for achieving this is described herein.

David L. Vowles

Papers

Optoelectronic tilt detector having tapered floors extending in same direction

Method of coupling an electrical signal to an optical fiber

Pressure sensor package for reducing stress-induced measurement error

Apparatus employing reflective optical means

Braided sleeve cutter and method