PROBLEM TO BE SOLVED: To provide: a photosensitive composition which forms a smooth photosensitive layer, has good storage stability and exhibits high sensitivity when a blue-violet laser exposure system is used; a photosensitive film; a permanent pattern forming method using the photosensitive composition; and a printed circuit board on which a permanent pattern is formed by the permanent pattern forming method. SOLUTION: The photosensitive composition comprises an alkali-soluble photosensitive resin, a polymerizable compound, a photopolymerization initiator or a photoinitiator compound, a heat crosslinkable resin, and a colorant, wherein the colorant comprises a pigment which contains halogen atoms of 5-50 mass% within a molecule and takes on yellow, and a pigment which contains no halogen atom within a molecule and takes on blue, in a mixing ratio (mass ratio) of 1:1 to 1:4, and the colorant takes on green by blending of those pigments and has a halogen content of ≤900 ppm in the total solid. There are also provided the photosensitive film, the permanent pattern forming method using the photosensitive composition, and the printed circuit board on which a permanent pattern is formed by the permanent pattern forming method. COPYRIGHT: (C)2008,JPO&INPIT

Photosensitive composition, photosensitive film, permanent pattern forming method and printed circuit board

A photosensitive resin composition and a photospacer having excellent flexibility and resilience are provided to be readily developed in alkali and to produce a curing product having excellent flexibility and resilience. A photosensitive resin composition comprises a hydrophilic polymer(A), a multifunctional (meth)acrylate monomer(B), a polysiloxane having at least two hydrolytic alkoxy groups(C) and a photopolymerization initiator(D). The polysiloxane(C) having at least two hydrolytic alkoxy groups is a product obtained by condensation using at least one of a silane compound(c1) represented by the formula(1) of R2mSi(R1)(OR3)3-m and a silane compound(c2) represented by the formula(2) of R4nSi(OR5)4-n, as an essential monomer. In the formulae, R1 is at least one organic group selected from C1-6 alkyl group, (meth)acryloyloxyalkyl group, glycidoxy alkyl group, mercaptoalkyl group and aminoalkyl group, R2 is saturated C1-12 aliphatic hydrocarbon group or C6-12 aromatic hydrocarbon group, R3 is C1-4 alkyl group, R4 is C1-12 saturated aliphatic hydrocarbon group or C6-12 aromatic hydrocarbon group, m is 0 or 1 and n is an integer of 0 to 2.

Photosensitive resin composition

Disclosed is a photocurable resin composition which comprises a photopolymerization initiator having two oxime ester groups in the molecule, a resin containing a carboxyl group, and a compound having two or more ethylenically unsaturated groups in the molecule. The composition can achieve high sensitivity, can provide a dried coating film having excellent touch dryness of fingers, can prevent the generation of an out gas during curing or the like, and can achieve all of excellent alignment accuracy, high productivity and high reliability in the formation of a solder resist for a printed wiring board or the like.

Photocurable resin composition

PROBLEM TO BE SOLVED: To provide a colored composition having excellent developability and allowing formation of a color filter in a high product yield.SOLUTION: The colored composition comprises (A) a colorant, (B) a binder resin, and (C) a polymerizable compound, wherein the (B) binder resin comprises a resin having a side chain expressed by formula (1) or (2) below. In the formulae, Rrepresents a saturated aliphatic group or the like; G represents a hydrogen atom or a monovalent organic group; ring Zrepresents an alicyclic hydrocarbon ring having 3 to 20 carbon atoms which may be substituted with an alkyl group having 1 to 4 carbon atoms or with a halogen atom; X represents -OCO-, -NR-, -SiRR-, or the like, where R, Rand Reach independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; s represents 1 or 2; and * represents a bond.

Coloring composition, colored cured film and display element

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a photosensitive resin laminate having good sensitivity, resolution and adhesion and excellent tenting property and sandblast resistance. SOLUTION: The photosensitive resin composition comprises (a) an ethylenically unsaturated addition polymerizable monomer, (b) an alkali-soluble polymer and (c) a photopolymerization initiator, wherein the photosensitive resin composition comprises a specific compound as the ethylenically unsaturated addition polymerizable monomer (a). COPYRIGHT: (C)2008,JPO&INPIT

PROBLEM TO BE SOLVED: To provide a photosetting and thermosetting resin composition giving a cured film excellent in adhesion, heat resistance, electroless plating resistance, moisture absorption resistance, PCT resistance and electric properties. SOLUTION: The composition comprises (A) a carboxylic photosensitive resin obtained by reacting the reaction product of a polynuclear epoxy compound (a) represented by formula (1) and an unsaturated group-containing monocarboxylic acid (b) with a polybasic acid anhydride (c), (B) a carboxylic photosensitive resin obtained by reacting the reaction product of a novolak type phenolic resin (e) and an alkylene oxide (f) with the unsaturated group- containing monocarboxylic acid (b) and reacting the resulting reaction product with the polybasic acid anhydride (c), (C) a photopolymerization initiator, (D) a photosensitive (meth) acrylate compound, (E) an epoxy compound and (F) a diluting solvent, wherein each X and Y are mutually different aromatic ring residues; each X is an aromatic ring residue of at least one aromatic epoxy resin having two glycidyl groups in one molecule selected from the group comprising biphenol type diglycidyl ether, bixylenol type diglycidyl ether, bisphenol type diglycidyl ether and naphthalene type diglycidyl ether; Y is an aromatic ring residue of at least one aromatic alcohol having two phenolic hydroxyl groups in one molecule selected from the group comprising dihydroxynaphthalene and its derivatives, biphenol and its derivatives, bixylenol and its derivatives, bisphenol and its derivatives, and hydroquinone derivatives; M is glycidyl and/or H; and n is an integer of 1-20. COPYRIGHT: (C)2004,JPO

Photosetting and thermosetting resin composition

PROBLEM TO BE SOLVED: To provide a curable composition excellent in storage stability, capable of taking the form of a one-part composition, and capable of giving a cured film highly able to withstand a pressure cooker test and excellent in moisture absorption resistance, etc. SOLUTION: The curable composition comprises (A) a mixture of a carboxyl-containing photosensitive compound (A-1) obtained by reacting a polybasic acid anhydride with the reaction product of a compound having at least two epoxy groups in the molecule with an unsaturation-containing monocarboxylic acid or a mixture thereof with an epoxy-reactive group and a carboxyl-containing photosensitive resin (A-2) obtained by reacting an unsaturation-containing monocarboxylic acid with the reaction product of a novolak phenolic resin with an alkylene oxide and/or a cyclic carbonate and reacting a polybasic acid anhydride with the obtained reaction product, (B) a 1,3-dioxolane-ring-containing epoxy resin obtained by effecting the partial addition reaction of an epoxy resin having at least two epoxy groups in the molecule with a ketone, and (C) a photopolymerization initiator. COPYRIGHT: (C)2007,JPO&INPIT

Curable composition and cured product thereof

PROBLEM TO BE SOLVED: To provide a photo- and/or heat-curable composition having excellent storage stability and giving an excellent cured film which satisfies such properties as hardness, heat resistance, chemical resistance, electroless gold plating resistance and electric insulation, and a cured product thereof. SOLUTION: The alkali-developable curable composition includes (A) a carboxyl group-containing epoxy resin having an acid number of 20-150 mgKOH/g and an epoxy equivalent of ≤3,000 g/eq., (B) a carboxyl group-containing compound, (C) a photosensitive (meth)acrylate compound, and (D) a photoinitiator, wherein the epoxy resin (A) is obtained by reacting epoxy groups in a resin (a) having two or more epoxy groups per molecule with a monocarboxylic acid (b) in a ratio of 0.3-0.9 mol to 1 equiv. epoxy group, reacting epoxy groups in the resultant reaction product (c) with a polybasic acid (d) in a ratio of 0.2-5 mols to 1 equiv. epoxy group, and further reacting epoxy groups in the resultant reaction product (e) with a monocarboxylic acid (f) in a ratio of 0.0-5.0 mols to 1 equiv. epoxy group. COPYRIGHT: (C)2010,JPO&INPIT

Alkali-developable curable composition and cured product thereof

PROBLEM TO BE SOLVED: To provide a curable composition giving an excellent cured film which satisfies such properties as electric insulation, PCT (pressure cooker test) resistance, adhesion, solder heat resistance, chemical resistance and resistance to electroless gold plating in addition to cracking resistance. SOLUTION: The curable composition comprises (A) a carboxylic photosensitive resin obtained by reacting a compound (a) having two or more phenolic hydroxyl groups in one molecule with an alkylene oxide (b) or cyclic carbonates (c), reacting the resulting reaction product (d) with an unsaturated-group-containing monocarboxylic acid (e) and a saturated aliphatic monocarboxylic acid (f) and/or an aromatic monocarboxylic acid (g), and reacting the resulting reaction product (h) with a polybasic acid anhydride (i), (B) a photopolymerization initiator, (C) a photosensitive (meth)acrylate compound and (D) a diluting solvent. COPYRIGHT: (C)2005,JPO&NCIPI

Composition containing carboxylic photosensitive resin

PROBLEM TO BE SOLVED: To obtain a curable composition which gives an excellent cured film satisfactory enough in characteristics such as electric insulation properties required by a resist for printed circuit boards, resistance to PCT (pressure cooker test), adhesiveness, soldering heat resistance, chemical resistance, and resistance to electroless gold plating. SOLUTION: This curable composition comprises a carboxyl-group-containing photosensitive resin (A), a photopolymerization initiator (B), a photosensitive (meth)acrylate compound (C) and a diluting solvent (D). The carboxyl-group-containing photosensitive resin (A) is prepared by reacting a reaction product (c) of a compound (a) having at least two phenolic hydroxyl groups with a cyclic carbonate (b) with an unsaturated-group-containing monocarboxylic acid (d) and/or its ester (e) and then reacting the resultant product (f) with a polybasic acid anhydride (g). Preferably, the curable composition further contains an epoxy resin (E) and a curing catalyst (F) and may further contain a resin (G) having carboxy groups. COPYRIGHT: (C)2005,JPO&NCIPI

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Papers

Photosetting and thermosetting resin composition

Curable composition and cured product thereof

Alkali-developable curable composition and cured product thereof

Composition containing carboxylic photosensitive resin

Curable composition containing carboxyl-group-containing photosensitive resin

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Papers

Photosetting and thermosetting resin composition

Curable composition and cured product thereof

Alkali-developable curable composition and cured product thereof

Composition containing carboxylic photosensitive resin

Curable composition containing carboxyl-group-containing photosensitive resin

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