An article having an electrical circuit component printed directly onto one side of a substrate includes the substrate and an electrical circuit component formed of a conductive liquid printed directly onto one side of the substrate. The electrical component is capable of performing its electrical circuit functions, as printed, and without the necessity for post-printing processes such as metal etching, catalytic ink activation, or electroless deposition.

An electrical circuit component formed of a conductive liquid printed directly onto a substrate

A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

Plating bath and method for depositing a metal layer on a substrate

A bath for electrodepositing ductile, lustrous copper which comprises an aqueous acidic copper plating bath containing dissolved therein a brightening amount of the reaction product of polyethyleneimine and an alkylating agent which will alkylate the nitrogen of the polyethyleneimine to produce a quaternary nitrogen, wherein the reaction temperature for the imine and alkylating agent ranges from about room temperature to about 120*C and the reaction product is present in the bath in an amount from about 0.1 to 1,000 milligrams per liter.

Electrodeposition of copper from acid baths

The invention is concerned with the electrodeposition of copper from an aqueous acidic bath containing the following additives: a. An alkylated polyalkyleneimine obtained as the reaction product of a polyalkyleneimine represented by the formula : H.sub.2 N--(CH.sub.2).sub.n NH--R wherein R is H or (CH 2 ) n NH 2 and n=1 to 6 with an epihalohydrin and an alkylating agent; an organic sulfo sulfonate; a polyether; and optionally a thioorganic compound.

Acid copper electroplating baths containing brightening and leveling additives

Electroplating methods using an electroplating bath containing metal ions and a suppressor additive, an accelerator additive, and a leveler additive, together with controlling the current density applied to a substrate, avoid defects in plated films on substrates having features with a range of aspect ratios, while providing good filling and thickness distribution. The methods include, in succession, applying DC cathodic current densities optimized to form a conformal thin film on a seed layer, to provide bottom-up filling, preferentially on features having the largest aspect ratios, and to provide conformal plating of all features and adjacent field regions. Including a leveling agent in the electroplating bath produces films with better quality after subsequent processing.

Electroplating process for avoiding defects in metal features of integrated circuit devices

B. sulfoalkyl sulfide compounds containing the grouping --S--Alk--SO3 M where M is one gram-equivalent of a cation and --Alk-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms.

Donald Alan Arcilesi

Papers

Electrodeposition of copper