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Drew V. Nelson

Researcher at Stanford University

Publications -  70
Citations -  2200

Drew V. Nelson is an academic researcher from Stanford University. The author has contributed to research in topics: Residual stress & Fiber optic sensor. The author has an hindex of 25, co-authored 70 publications receiving 2091 citations.

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Understanding thermal behavior in the LENS process

TL;DR: In this article, the authors describe the use of contact and imaging techniques to monitor the thermal signature during LENS processing and develop an understanding of solidification behavior, residual stress, and microstructural evolution with respect to thermal behavior.
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Evaluation of an energy-based approach and a critical plane approach for predicting constant amplitude multiaxial fatigue life

TL;DR: A new energy-based approach for predicting constant amplitude multiaxial fatigue life is described in this article, which is based on cyclic plastic and elastic strain energy densities and takes into account effects of stress state and mean stresses.
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A fiber optic sensor for transverse strain measurement

TL;DR: In this paper, a fiber optic sensor capable of measuring two independent components of transverse strain is described, which consists of a single Bragg grating written into high-birefringent, polarization-maintaining optical fiber.
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Residual-stress determination through combined use of holographic interferometry and blind-hole drilling

TL;DR: In this article, the authors used holographic interferometry to determine in-plane radial displacements due to release of residual stresses by hole drilling, analogous to relations used in the conventional strain-rosette technique.
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Residual-stress determination by single-axis holographic interferometry and hole drilling—Part I: Theory

TL;DR: In this article, a method is described for the rapid, accurate determination of residual stresses from a holographic interference fringe pattern, which is generated by the displacement field caused by localized relief of residual stress via the introduction of a small, shallow hole into the surface of a component or test specimen.