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Showing papers by "Eric R. Heller published in 2012"


Proceedings ArticleDOI
18 Mar 2012
TL;DR: In this article, the authors used CCD imaging with sub-micron spatial resolution to characterize self heating nonuniformity in two finger AlGaN/GaN high electron mobility power transistors at equivalent power (1.27 W).
Abstract: Thermoreflectance CCD imaging with sub-micron spatial resolution was used to characterize self heating nonuniformity in two finger AlGaN/GaN high electron mobility power transistors at equivalent power (1.27 W) for different combinations of drain and gate voltage. Thermoreflectance images of device surface temperature revealed formation and redistribution of local hotspots as transistor drain voltage increased from V D =10.7 V to 50 V. For all bias points, heating between the two fingers was not fully uniform. At high drain voltage, heating migrated toward the drain side of the channel and increased thermal nonuniformity was observed along symmetric drain and source fingers. Direct microthermocouple measurements confirmed the spatial temperature nonuniformity that was observed in thermoreflectance images. Results demonstrated the usefulness of fast thermoreflectance imaging to inspect self heating in GaN thin film power devices with high with high spatial resolution.

13 citations


Journal ArticleDOI
TL;DR: In this article, the authors report an extremely robust GaN HEMT technology that survived high forward gate bias (i.e., high forward bias) in a GaN-HEMT.
Abstract: Reports to date of GaN HEMTs subjected to forward gate bias stress include varied extents of degradation. We report an extremely robust GaN HEMT technology that survived—contrary to conventional wisdom—high forward gate bias (

7 citations