Improved compositions for polishing silicon, silica or silicon-containing articles is provided which consists of an aqueous medium, abrasive particles and an anion which controls the rate of removal of silica. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.

Compositions and methods for polishing

The present invention relates to an improved chemical-mechanical polishing (CMP) method for polishing a copper coated wafer containing a copper adhesion-promoting layer and a silicon-based layer. The method polishes copper layers with high removal rates, low defect densities and reduced amounts of dishing and erosion. The method involves a two step process. The first step is to utilize a bulk copper removal slurry that rapidly removes the majority the copper on the substrate. The second step utilizes a 1:1:1 selectivity copper/tantalum/silicon dioxide (Cu/Ta/SiO 2 ) slurry that has approximately the same polishing rates for the copper layer, the adhesion-promoting layer and the silicon-based substrate. The second slurry reduces the amount of dishing and erosion that occurs in the copper trenches and dense copper arrays.

Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys

The LCD according to present invention includes a first substrate and a second substrate, two protective layers including at least one layer formed on outer surface of the first and second substrates, a transparent electrode formed on inner surface of the first substrate or the second substrate, an alignment layer formed on the transparent electrode, and two polarizers attached on the first and second substrates.

Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same

A low reflectance glass surface is disclosed which includes a particular combination of surface structures which produce a low reflectance yet high clarity glass. The surface structure includes a plurality of islands distributed at a density of about 60 to 10,000 islands per square millimeter. The glass surface also includes a skeletalized silica structure of 200 to 600 angstroms in diameter, uniformly distributed over the surface. By combining the various surface structures on one piece of glass, unique properties of low reflectance yet high clarity are provided, which is particularly suitable for use in picture frames where any distortion would distract from viewing a picture contained therein and also in computer or t.v. screens where distortion or glare could produce operator fatigue or stress. The glass structure is achieved by a process which is readily adaptable to existing production lines without requiring major modifications. Consequently, the low glare high clarity glass can be produced economically, allowing use in applications not previously adaptable to the highly expensive anti-reflection glass previously available.

Anti-reflective glass surface

A system, a composition, and a method for planarizing or polishing a composite substrate are provided. The planarizing or polishing system comprises (i) a polishing composition comprising (a) about 0.5 wt.% or more of fluoride ions, (b) about 1 wt.% or more of an amine, (c) about 0.1 wt.% or more of a base, and (d) water, and (ii) and abrasive. The present invention also provides a method of planarizing or polishing a composite substrate comprising contacting the substrate with a system comprising (i) a polishing composition comprising (a) about 0.5 wt.% or more of fluoride ions, (b) about 1 wt.% or more of an amine, (c) about 0.1 wt.% or more of a base, and (d) water, and (ii) an abrasive.

System for the preferential removal of silicon oxide

The invention relates to a polishing method for pressed glass or ground glass articles. As is conventional, polishing is effected in a bath containing sulfuric acid and hydrofluoric acid. Rinsing with a sulfuric acid and/or water washing bath intervenes and follows the polishing process. According to the method of the invention, the sodium and/or potassium ions resulting from the dissolution of glass constituents are removed from the polishing bath by the following means: (a) by adding fluorosilicic acid to the polishing bath, precipitating the corresponding silicofluorides and filtering off the solid matter, (b) by electrolysis in a mercury cell with the formation of sodium- and/or potassium amalgam, (c) by electrolysis in a cell having a cation semi-permeable membrane or (d) with the aid of cation exchangers.

Method of polishing glass ware with sulfuric acid and hydrofluoric acid

Verfahren zum schwefelsaeure-flusssaeure-polieren von glasgegenstaenden.

The invention relates to a polishing method for pressed glass or ground glass articles, wherein the polishing is carried out as usual containing in a bath of sulfuric acid and hydrofluoric acid, and is rinsed off between and after the polishing process with a sulfuric acid and / or water-washing bath. According to the inventive method originating from the release of glass constituents sodium and / or potassium ions are removed from the polishing bath, namely a), by adding Silicofluorwasserstoffsaure for polishing bath with precipitation of the corresponding Silicofluoride and filtering the solids b) by electrolysis in a mercury cell to form sodium and / or potassium amalgam, c) by electrolysis in a cell membrane or kationensemipermeabler d) by means of cation exchangers.

Erich Dr. Sälzle

Papers

Method of polishing glass ware with sulfuric acid and hydrofluoric acid

Verfahren zum schwefelsaeure-flusssaeure-polieren von glasgegenstaenden.

Process for polishing glass objects by sulphuric and fluorhydric acid