An interconnect structure comprising an interconnection formed between a bond pad and the end of a lead. The layer includes nickel, copper, cobalt, palladium, platinum, silver or gold and is electrically conductive. Also, an apparatus for forming an interconnection by a metal plating process and a device having a lead, a substrate, and a bath containing an aqueous metal plating solution which permits formation of the interconnect structure. A method of forming an interconnect structure including the step of placing a lead adjacent to a bond pad and placing the two in an electroless plating solution so that the interconnect structure may be formed.

Method for bonding a lead to a die pad using an electroless plating solution

A plurality of electrode pads are formed on a main surface of a semiconductor chip. The electrode pads on the semiconductor chip are electrically connected to the top end of an inner lead through a metal plating layer.

Method for manufacturing a semiconductor device wherein a semiconductor chip is connected to a lead frame by metal plating

An apparatus and method for the electroless plating of articles. A tank (10) is provided for sequentially containing the respective constituent baths corresponding to the steps of the electroless plating process. An article to be plated (38), such as a printed circuit board, is supported in the center of the tank immersed in the constituent bath contained therein. A pair in inwardly facing parallel manifolds (18) and (20) are disposed at opposite ends of the tank. The constituent solution is pumped through a nozzle matrix (35) in the inward facing wall (30) of a first manifold (18) onto the article and is simultaneously sucked away from the opposing side of the article through the matrix of the nozzles (37) defined in the inward facing wall (32) of a second manifold (20). The direction of pumping is alternated for periodically reversing the direction of suction and impingement. The alternating pressure difference created across the surface of the article being plated substantially improves the rate of metal deposition over prior art systems and allows for a uniform and high quality plate over the entire surface of the article. Additionally, through-holes defined in the article are thoroughly and uniformly deposited with electroless metal.

Apparatus and method for electroless plating

A method and apparatus (10) for the electroless nickel plating of long bodies (12) including a deep tank (11) capable of supporting at least one long body (12) in a substantially vertical position and immersed in an electroless nickel plating solution (32), a fluid distribution system (18-29) including a plurality of vertically spaced sparger outlets (31, 31') within the tank (11) and means for discharging (30) filtered, heated, plating solution through the sparger outlets (31, 31') generally directed toward or around the long body (12) within the tank (11) to provide directionalized dispersion of the solution (32) throughout substantially the full depth of the tank (11).

Method for the electroless nickel plating of long bodies

In a system for electroplating a printed circuit board in which multiple spray orifices are provided in arrays on opposite sides of the circuit board, and multiple vacuum orifices are interspersed symmetrically and midway between adjacent spray orifices, a mounting means is provided for rapid and accurate locating of the printed circuit board in two selectively offset alternative positions to facilitate forming an electroplated layer of uniform thickness. The printed circuit board is supported from an elongate copper bar, with two alignment members mounted to opposite ends of the bar. A pair of saddles are fixed with respect to the tank containing the electrolyte. Each of the saddles has two V-shaped mounting surfaces conforming to the alignment members for a nesting engagement. The mounting surfaces of each saddle are offset from one another a predetermined horizontal and vertical distance, whereby alternative nesting engagements of the alignment members and saddles support the circuit borad in alternative positions, respectively aligning particular circuit board surface areas with spray orifices, and then with vacuum orifices.

Cradle for supporting printed circuit board between plating manifolds

Electroless plating using alternate operative plating tanks of glass fiber reinforced urethane with polypropylene liners, and a third tank of cleaning fluid applied to the tank not being used.

Evo Del Vecchio

Papers

Electroless nickel plating apparatus