F. Che Ani

TL;DR: In this paper, a three-dimensional simulation and experimental investigation of polymer rheology in a miniature injection molding process is presented, where the simulation results are in good conformity and the strength of FLUENT 6.3 in handling injection mold filling problems is proved to be excellent.

TL;DR: In this paper, the effect of the pin-through-hole (PTH) shape on the soldering stage using wave soldering technique was investigated. But the results were limited to a single circular pin and compared with FLUENT simulation.

TL;DR: In this paper, the authors developed a thermal coupling method of a ball grid array assembly during a forced convection reflow soldering process, where the reflow oven was modeled in computational fluid dynamic (CFD) software and the structural heating BGA package simulation was done using finite element method (FEM) software (ABAQUS 6.3.9).

TL;DR: In this article, a finite volume method (FVM) based numerical simulation is used for the flow visualization of capillary driven underfill process for different solder bump arrangements of flip chip packages is presented.

TL;DR: In this paper, the effects of pin through-hole offset position in a wave soldering process were investigated using finite volume-based simulation of the filling of molten solder and the capillary action between printed circuit board and PTH connector.