Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

Limiting tin sludge formation in tin or tin/lead electroplating solutions

A plating bath for electrodeposition of tin/lead alloys contains stannous ion, lead ion, a fluoborate, fluosilicate or sulfamate radical and, as a brightener system, a nonionic polyoxyalkylated surfactant, a lower aliphatic aldehyde, an amine and a cyclic brightener selected from the group consisting of heterocyclic carboxaldehydes, aromatic ketones and carboxylic acids, the pH of the bath being less than about 3.0.

Tin/lead plating bath and method

A process for depositing tin upon a steel strip by high speed electroplating to produce tinplate, which includes a basis solution of an alkyl sulfonic acid, a solution soluble tin compound and a surfactant, preferably of an alkylene oxide condensation compound of 1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or 2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of six carbon atoms or less. After electroplating, the tinplate is rinsed and the rinse water only needs to be treated for removal of tin ions prior to discharge by normal procedures.

High speed electroplating of tinplate

A bath for the electrodeposition of bright tin-lead alloys which comprises an aqueous acidic bath containing at least one soluble tin compound and one soluble lead compound to which there has been added: A. a lower alkylene oxide condensation product, and B. an effective amount of at least one pyridine or quinoline compound having the structure ##STR1## wherein the substituents R1, R2, R3, R4 and R5 each is a hydrogen or halogen atom, a lower alkyl radical containing a hydroxyl group, an alkenyl radical, the radical (Cn H2n --CO2 H in which n has a value from 0 to 6 or a carbamide radical or R4 and R5 combined form a divalent radical to provide a compound having the structure ##STR2## in which R6 is nothing or a hydroxyl radical; Z is nothing, 0- or a quaternary ammonium forming hydrocarbon radical provided that when Z is nothing, at least one of the substituents R1, R2, R3, R4 and R5 is a halogen atom, a lower alkyl radical containing a hydroxyl group, an alkenyl radical, the radical (Cn H2n --CO2 H in which n has a value from 0 to 6 or a carbamide radical or R6 is a hydroxy radical; and X is nothing or when Z is a quaternary ammonium forming hydrocarbon radical X is an anion. The invention also includes the addition of an aromatic aldehyde in combination with pyridine or quinoline compounds and the alkylene oxide condensation product which results in the production of even brighter to brilliant deposits over a wide current density range.

Electrodeposition of tin, lead and tin-lead alloys

The invention relates to the electrolytic plating of tin and lead metals and particularly to tin-lead alloys by dissolving divalent tin or lead compounds in an excess of a lower alkyl sulfonic acid or acid salt. The electrolytic bath comprises such additives as benzal acetone, benzaldehyde or derivatives thereof, aromatic pyridines; surfactants such as betaines, alkylene oxides polymers, imidazolinium compounds and quaternary ammonium salts and formaldehyde.

Bath and process for electroplating tin, lead and tin/alloys

SEMIBRIGHT TO BRIGHT DEPOSITS OF TINC-LEAD ALLOYS ON ARTICLES ARE PRODUCED BY ELECTROPLATING THE ARTICLES WITH AN ELECTROPLATING BATH COMPRISING A THIN COMPOUND, A LEAD COMPOUND, PREFERABLY THE FLUOBORATES OF STANNOUS TIN AND PLUMBOUS LEAD, FLUOBORIC ACID, BORIC ACID, A WETTING AGENT, AND, AS BRIGHTENING AGENT, A METHYLENE ANILINE COMPOUND OR A DIAMINO DIPHENYLMETHANE COMPOUND, PREFERABLY IN COMBINATION WITH A BRIGHTENER AS CONVENTIONALLY USED IN ELECTROPLATING TIN BATHS.

F Sedlacek

Papers

Electroplating bath for depositing tin-lead alloy plates